Apparatus for selectively applying solder paste to multiple types of printed circuit boards

A screen printer for selectively applying solder paste to multiple types of printed circuit (pc) boards, comprising:

• mobile placement equipment for receiving and transporting a pc board;
• application equipment for selectively applying the solder paste to the pc board, the application equipment comprising:
• a first stencil;
• a second stencil;
• a frame for securing the first and second stencils in fixed positions;
• and
• an applicator for selectively applying the solder paste to the pc board through one of the first and second stencils;
• a controller coupled to the mobile placement equipment, the controller including means for determining a type of the pc board and including means for directing the mobile placement equipment, wherein the directing means of the controller directs the mobile placement equipment to a first location aligned with the first stencil in response to the determining means determining that the pc board is of a first type, and wherein the directing means of the controller further directs the mobile placement equipment to a second location aligned with the second stencil in response to the determining means determining that the pc board is of a second type;
• and
• wherein the applicator, in response to a signal received from the controller, pushes the solder paste through the first stencil onto the pc board when the pc board is of the first type and through the second stencil onto the pc board when the pc board is of the second type.