Method for forming a lead during molding of an electronic housing
AssigneeDelco Electronics Corporation
InventorsLloyd A. Groves, Phil O. Whelchel
Life of this patent
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Abstract
A molding apparatus and a molding method are provided which enable leads which project from an electronic housing, such as a housing configured to receive an accelerometer, to be formed during the molding operation in which the housing is formed. As a result, the leads used in the molding operation can be in an as-stamped, unformed condition, so as to facilitate handling and loading of the leads into the molding apparatus. In addition, because forming occurs during the molding operation, subsequent secondary forming operations are not required to achieve the desired configuration for the leads.
Claims20
A method for forming a lead during the molding of a housing from which said lead extends, said method comprising the steps of:
- positioning a first portion of said lead within a mold cavity for said housing as defined by a pair of mold halves;
- sufficiently closing said pair of mold halves so as to secure said first portion of said lead within said mold cavity such that a second portion of said lead projects from said mold cavity and between said pair of mold halves;
- performing a forming operation on said second portion of said lead to bend said second portion of said lead into a predetermined configuration suitable for electrical connection external to said housing;
- and
- opening said pair of mold halves so as to release said housing and said lead, said lead being integrally molded with said housing.
A method for forming a plurality of leads during the molding of a housing with which said plurality of leads is molded and from which said plurality of leads extends, said method comprising the steps of:
- positioning a lead frame at least partially within a mold cavity for said housing as defined by a pair of mold halves, said lead frame being integrally formed with and supporting said plurality of leads;
- sufficiently closing said pair of mold halves so as to secure said lead frame between said pair of mold halves such that a portion of each of said plurality of leads projects from said mold cavity and between said pair of mold halves;
- performing a forming operation on said portion of at least one of said plurality of leads to bend said portion of at least one of said plurality of leads into a predetermined configuration suitable for electrical connection external to said housing;
- and
- opening said pair of mold halves so as to release said housing and said plurality of leads, said plurality of leads being integrally molded with said housing.
An apparatus for molding a housing and forming a lead which extends from said housing, said apparatus comprising:
- a pair of mold halves which together define a mold cavity for said housing;
- means associated with said pair of mold halves for locating at least a first portion of said lead within said mold cavity such that a second portion of said lead projects from said mold cavity and between said pair of mold halves;
- means associated with said pair of mold halves forming said second portion of said lead to bend said second portion of said lead into a predetermined configuration suitable for electrical connection external to said housing;
- and
- means formed in at least one of said pair of mold halves for introducing molten material into said mold cavity for forming said housing;
- whereby said housing is molded and said lead is formed within said apparatus substantially during a single operating cycle, such that said lead is integrally molded with said housing.
Dependencies are inferred from the claim text.