Heat treating method and device
AssigneesTokyo Electron Limited, Tokyo Electron Tohoku Kabushiki Kaisha
InventorsEiji Yamaguchi, Kaoru Fujihara, Takenobu Matsuo, Hirofumi Kitayama
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AssigneesTokyo Electron Limited, Tokyo Electron Tohoku Kabushiki Kaisha
InventorsEiji Yamaguchi, Kaoru Fujihara, Takenobu Matsuo, Hirofumi Kitayama
Estimating the term…
A heat treating device including a pressure detecting unit for outputting an output signal when a pressure in a heat processing furnace becomes a set value, an air release pipe having a first valve and a check valve, a differential pressure gauge shut off by a second valve in terms of pressure from the interior of the heat processing furnace, and an air feed pipe having a third valve. One ends of each of the air release pipe and the air feed pipe is connected respectively to the heat processing furnace and the other ends opened in air. In such arrangement, after processing gases are evacuated from the heat processing furnace, an inert gas is fed. Then when an internal pressure of the furnace becomes near an air pressure, the first valve is opened in response to the output signal of the pressure detecting unit to make the internal pressure of the heat processing furnace a little higher than the air pressure. When a differential pressure value of the differential pressure gauge is below a set value, the third value is opened to communicate the interior of the heat processing furnace with air through the air feed pipe. Then the cap closing the opening of the heat processing furnace is opened.
A heat treating method comprising:
A heat treating device in which a number of objects to be treated are loaded into a heat processing furnace, mounted on holding means and are heat treated therein, an inert gas is introduced into the heat processing furnace after the heat treatment, and a cap closing an opening of the furnace is opened to unload the objects on the holding means out of the furnace, the device comprising:
Dependencies are inferred from the claim text.