Autonomous selective cutting method and apparatus
AssigneeSeamX
InventorZev Galel
Life of this patent
Estimating the term…
Abstract
Real time in-process data is collected to determine the contour and position of the interface between dissimilar layers of material. A control system is automatically programmed, based on the determined contour and position of the interface, to autonomously control the trajectory of a cutter through a conventional motion control system to separate the dissimilar layers of material. The motion control system controls the cutter movement through, for example, a conventional linear motion device including a servomotor, lead screw, and slidable carriage that holds the cutter.
Claims18
A method for separating dissimilar layers of material comprising:
- providing a cutter and a structure having first and second dissimilar layers of material;
- scanning the structure and detecting points representing the surface of the first layer adjacent the second layer;
- rotating the structure and reflecting a beam off an element which is associated with the structure and rotates therewith to detect each revolution of the structure;
- and
- controlling the position of the cutter based upon the points detected in the scanning step such that the cutter follows a path along the first layer and removes the second layer from the first layer.
A method for separating dissimilar layers of material comprising:
- providing a cutter and a Structure having first and second dissimilar layers of material;
- providing the structure with a reflective surface, rotating the structure, and emitting a light beam in the path of the reflective surface such that the beam is reflected off the reflective surface during a complete revolution of the structure;
- scanning the structure and detecting points representing the surface of the first layer adjacent the second layer;
- and
- controlling the position of the cutter based upon the points detected in the scanning step such that the cutter follows a path along the first layer and removes the second layer from the first layer.
A method of separating dissimilar layers of material joined at an interface, said second layer forming an outer surface opposite said interface, said method comprising the steps of:
- (a) autonomously scanning said, outer surface, sensing features of said structure along said outer surface, and Collecting data points indicative of the sensed features;
- (b) autonomously comparing one collected data point corresponding to one sensed feature on the workpiece with other collected data points corresponding to sensed features adjacent the one sensed feature and retaining the one collected data point if it conforms by a predetermined degree to each of the other collected data points;
- and
- (c) autonomously controlling the position of a cutter, based on data generated and retained in steps (a) and (b), to follow said interface and remove the second layer from the first layer.
The method of claim 11 wherein step (b) comprises discarding said one collected data point and replacing it with an adjacent data point if it does not conform by said predetermined degree to each of said other collected data points, unless it conforms by a predetermined degree with a number of data points collected subsequent in time and in close proximity therewith.
A method Of separating dissimilar layers of material joined at an interface, said second layer forming an outer surface opposite said interface, said method comprising the steps of:
- (a) autonomously scanning said outer surface;
- (b) detecting the distance between each point on the structure and a reference point;
- (c) converting each detected distance into a digital representation;
- (d) storing the digital representations in a data memory;
- (e) selecting digital representations which correspond to the distance between said interface and said reference point by comparing the distance values represented by digital representations related to scanned points on the structure that are relatively close in proximity to one another;
- and
- (f) autonomously controlling the position of a cutter, based on the selected digital representations of step (a), to follow said interface and remove the second layer from the first layer.
A method for cutting a rotating workpiece at a constant depth comprising the steps of:
- (a) securing said workpiece to a rotatable workpiece holder;
- (b) scanning the outer peripheral surface of the workpiece and detecting points representing that surface;
- (c) rotating the workpiece;
- and
- (d) directing a cutter along a path parallel to the contour of said surface at a constant depth in said workpiece by autonomously controlling the position of the cutter based upon the points detected in the scanning step.
The method of claim 18 wherein step (a) includes eccentrically mounting the workpiece relative to the rotational axis of the workpiece holder.
A cutting system comprising:
- a rotatable fixture;
- a workpiece mounted on said fixture for rotation therewith;
- a reflector coupled to one of said fixture and workpiece;
- and
- a cutting head having a cutting tip movably mounted thereto and positioned for moving toward and away from said workpiece, said cutting head being coupled to said fixture and further including a sensor oriented for receiving a signal reflected off said reflector upon each revolution of the workpiece.
Dependencies are inferred from the claim text.