Testing and exercising individual, unsingulated dies on a wafer

A method of providing signals from a common external source to individual, unsingulated dies on a semiconductor wafer, comprising:

• forming a plurality of individual integrated circuit dies on a semiconductor wafer, each die occupying a distinct one of a like plurality of first areas on the wafer;
• providing an electronic selection mechanism in a second area of the wafer distinct from the plurality of first areas of the wafer;
• providing pads for receiving signals from a source external to the wafer;
• providing on each die, within the area of the die, an address decoding circuit associated with the die, each address decoding circuit being responsive to a unique address at a multibit address input of the address decoding circuit to permit the signals to be received by the die with which the address decoding circuit is associated;
• causing the electronic selection mechanism to address one or more of the plurality dies, by Outputting a multi-bit address signal associated with the one or more dies;
• providing a multi-bit address bus of conductive lines between the electronic selection mechanism and the plurality of dies;
• receiving the signals from the external source;
• and
• routing the signals, over the multi-bit address bus, to the selected one of more of the plurality of dies.