Silicon carbide wafer bonded to a silicon wafer
AssigneeTexas Instruments Incorporated
InventorSatwinder Malhi
Life of this patent
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Abstract
A silicon carbide structure (10) and method capable of using existing silicon wafer fabrication facilities. A silicon wafer (20) is provided which has a first diameter. At least one silicon carbide wafer (30) is provided which has a given width and length (or diameter). The width and length (or diameter) of the silicon carbide wafer (30) are smaller than the diameter of the silicon wafer (20). The silicon wafer (20) and the silicon carbide wafer (30) are then bonded together. The bonding layer (58) may comprise silicon germanium, silicon dioxide, silicate glass or other materials. Structures such as MOSFET (62) may be then formed in silicon carbide wafer (30).
Claims9
A method for forming a silicon carbide structure comprising the steps of:
- a. providing a silicon wafer having a diameter;
- b. providing at least one silicon carbide wafer having a maximum width and a maximum length wherein said maximum width and said maximum length are smaller than said diameter;
- c. polishing said silicon wafer and said at least one silicon carbide wafer;
- d. depositing a first layer of silicon germanium having a melting point on a surface of said silicon wafer;
- e. depositing a second layer of silicon germanium having said melting point on a surface of said silicon carbide wafer;
- f. contacting said first layer of silicon germanium to said second layer of silicon germanium;
- and
- g. heating said silicon wafer, silicon carbide wafer and first and second silicon germanium layers to a temperature greater than said melting point to bond said at least one silicon carbide wafer to said silicon wafer.
A method for forming a silicon carbide structure comprising the steps of:
- a. providing a silicon wafer;
- b. providing at least two silicon carbide wafers each having a size and shape smaller than said silicon wafer so that all said silicon carbide wafers can rest entirely on said silicon wafer;
- c. polishing said silicon wafer and said silicon carbide wafers;
- d. forming a first layer of a bonding material having a melting point on a surface of said silicon wafer;
- e. forming a second layer of said bonding material having said melting point on a surface of each said silicon carbide wafer;
- f. contacting said first layer of bonding, material on said silicon wafer to said second layer of bonding material on each said silicon carbide wafer;
- and
- g. heating said silicon wafer, silicon carbide wafers and first and second bonding material layers to a temperature greater than said melting point to bond said silicon carbide wafers to said silicon wafer wherein said bonding material is silicon germanium.
Dependencies are inferred from the claim text.