US 5,440,794 AGranted

Method of manufacturing laminated ceramic capacitors

AssigneeMurata Manufacturing Co., Ltd.

InventorsMichio Kaeriyama, Masaaki Taniguchi

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Abstract

A method of manufacturing an electronic component including a step wherein green-sheets each having one main surface on which a number of first interior electrodes or second interior electrodes are printed and green-sheets each having no printed electrodes are laminated in a direction orthogonally intersecting the respective main surfaces of the green-sheets so as to form a block, which is then fired. The fired block is cut or sliced in the direction orthogonally intersecting the main surface of the green-sheets so as to form a mother board with respective ends of the first interior electrodes and the second interior electrodes exposed on one main surface and the other main surface of the mother board, respectively. Thereafter, respective exterior electrodes are applied onto both main surfaces of the mother board and chips are cut out of the mother board, whereby laminated capacitors each having a first exterior electrode and a second exterior electrode respectively connected to the first interior electrodes and the second interior electrodes can be obtained.

Claims5

Dependent claims

A method of manufacturing laminated ceramic capacitors by cutting chips out of a mother board, said method comprising the steps of:

(a) preparing a mother board having a first and second main surface, interior electrodes in the mother board with respective ends of the interior electrodes exposed on at least one of said main surfaces of the mother board,
wherein said mother board is prepared by the steps of:
(a-1) preparing a plurality of green-sheets, each green-sheet having at least one main surface, a plurality of individual interior electrodes formed on the respective main surfaces of the green-sheets;
(a-2) forming a block by laminating said plurality of green-sheets in a direction orthogonally intersecting the respective main surfaces of the green-sheets;
and
(a-3) forming the mother board by slicing said block in a direction orthogonally intersecting the respective main surfaces of said green-sheets;
(b) forming exterior electrodes electrically connected with said respective ends of the interior electrodes, said exterior electrodes being formed on said at least one of said main surfaces of said mother board;
and
(c) dicing said mother board to obtain respective chips of said laminated ceramic capacitors.

6 more elements

Dependencies are inferred from the claim text.