Gas discharge displays and methodology for fabricating same by micromachining technology
AssigneePhilips Electronics North America Corporation
InventorsBabar A. Khan, David A. Cammack, Ronald D. Pinker, Jerry M. Kramer
Life of this patent
Estimating the term…
Abstract
A gas discharge display and the method of making same utilizing integrated circuit fabrication techniques. The display is manufactured from heat and pressure resistant planar substrates in which cavities are etched, by integrated circuit manufacturing techniques, so as to provide individual pixels. Orthogonal electrodes are deposited on the substrates and extend into the cavities. The cavities are filled with gas discharge materials, such as plasma, upon energization of the electrodes the individual cavities forming the pixels may be individually activated.
Claims12
A gas discharge display having first and second substrates of material capable of withstanding heat and pressure;
- a plurality of cavities disposed in at least one of said first and second substrates;
- a series of first electrodes disposed on at least one of said first and second substrates, at least one of said first electrodes having a portion extending into one or more of said cavities, a series of second electrodes disposed on at least one of said first and second substrates, at least one of said second electrodes having a portion extending into one or more of said cavities, each of said cavities having a first and a second electrodes disposed therein;
- luminescent gas discharge material disposed in said cavity;
- said first and second substrates being wafer bonded together such that said substrates are joined together at all points of contact.
A method for fabricating a gas discharge display comprising the steps of:
- providing a first and second substrates of material capable of withstanding heat and pressure;
- etching a plurality of cavities in at least one of said substrates;
- providing a first series of electrodes on at least one of said first and second substrates, providing a second series of electrodes on at least one of said first and second substrates, positioning said first and second electrodes such that at least a portion of said first and second of electrodes extends into each of said cavities, and wafer bonding said first and second substrates together in an atmosphere of gas discharge material such that all points of surface contact between the substrates are bonded together to seal said cavity and to enclose said gas discharge material within each of said cavities.
Dependencies are inferred from the claim text.