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US 5,438,305 AGranted
High frequency module including a flexible substrate
AssigneesHitachi, Ltd., Hitachi Denshi Kabushiki Kaisha, Hitachi Video & Information System, Inc.
InventorsMitsutaka Hikita, Atsushi Sumioka, Takatoshi Akagi, Toyoji Tabuchi, Nobuhiko Shibagaki
Life of this patent
Estimating the term…
Abstract
A high frequency module is disclosed which comprises a high frequency device in a package, a circuit formed on a flexible substrate in the package, the circuit, the high frequency device and input/output terminals of the package being connected electrically.
Claims21
A high frequency module comprising:
- a package comprising a first package portion having first terminals and a second package portion;
- a high frequency device having second terminals;
- and,
- a flexible substrate having wiring conductor patterns thereon including at least one of a distributed constant circuit and a lumped constant circuit;
- said first package portion having said high frequency device disposed therein;
- said flexible substrate with said at least one of said distributed constant circuit and lumped constant circuit being disposed above said high frequency device;
- said second package portion being disposed above said flexible substrate with said at least one of said distributed constant circuit and lumped constant circuit;
- and,
- said flexible substrate being of bent shape such that said wiring conductor patterns contact said first terminals of said first package portion and said second terminals of said high frequency device and said wiring conductor patterns on said flexible substrate being electrically connected such that said at least one of said distributed constant circuit and said lumped constant circuit performs impedance matching or transformation for said high frequency device.
6 more elements
A high frequency module comprising:
- a package comprising a first package portion having first terminals and a second package portion;
- a high frequency device having second terminals;
- and,
- a flexible substrate having wiring conductor patterns including at least one of a distributed constant circuit and a lumped constant circuit;
- said first package portion having said high frequency device disposed therein;
- said flexible substrate with said at least one of said distributed constant circuit and lumped constant circuit being disposed above said high frequency device;
- said second package portion being disposed above said flexible substrate with said at least one of said distributed constant circuit and lumped constant circuit;
- and,
- said first terminals of said first package portion being connected to post-like conductors to provide contact with said wiring conductor patterns on said flexible substrate said second terminals of said high frequency device and said wiring conductor patterns on said flexible substrate being electrically connected, such that said at least one of said distributed constant circuit and lumped constant circuit performs impedance matching or transformation for said high frequency device.
6 more elements
A high frequency module comprising:
- a package comprising a first package portion having first terminals and a second package portion;
- a high frequency device having second terminals;
- and,
- a flexible substrate having a wiring conductor pattern including at least one of a distributed constant circuit and a lumped constant circuit;
- said first package portion having said high frequency device disposed therein;
- said flexible substrate with said at least one of said distributed constant circuit and lumped constant circuit being disposed above said high frequency device;
- said second package portion being disposed above said flexible substrate with said at least one of said distributed constant circuit and lumped constant circuit;
- and,
- dummy chips substantially flush with said high frequency device being disposed on said first terminals of said first package portion to provide contact between a conductor disposed on a surface of each of said dummy chips and the wiring conductor pattern disposed on said flexible substrate and said second terminals of said high frequency device and said wiring conductor pattern on said flexible substrate being electrically connected such that said at least one of said distributed constant circuit and lumped constant circuit performs impedance matching or transformation for said high frequency device.
6 more elements
A radio communication device comprising:
- a package comprising a first package portion having first terminals and a second package portion;
- a high frequency device having second terminals;
- and,
- a flexible substrate having wiring conductor patterns including at least one of a distributed constant circuit and a lumped constant circuit;
- said first package portion having said high frequency device disposed therein;
- said flexible substrate with said at least one of said distributed constant circuit and lumped constant circuit being disposed above said high frequency device;
- said second package portion being disposed above said flexible substrate with said at least one of said distributed constant circuit and lumped constant circuit;
- and,
- said first terminals of said first package portion being connected to post-like conductors to provide contact with said wiring conductor patterns on said flexible substrate and said second terminals of said high frequency device and said wiring conductor patterns on said flexible substrate being electrically connected such that said at least one of said distributed constant circuit and lumped constant circuit performs impedance matching or transformation for said high frequency device.
6 more elements
A radio communication device comprising:
- a package comprising a first package portion having first terminals and a second package portion;
- a high frequency device having second terminals;
- and,
- a flexible substrate having a wiring conductor pattern including at least one of a distributed constant circuit and a lumped constant circuit;
- said first package portion having said high frequency device disposed therein;
- said flexible substrate with said at least one of said distributed constant circuit and lumped constant circuit being disposed above said high frequency device;
- said second package portion being disposed above said flexible substrate with said at least one of said distributed constant circuit and lumped constant circuit;
- and,
- dummy chips substantially flush with said high frequency device being disposed on said first terminals of said first package portion to provide contact between a conductor disposed on a surface of each of said dummy chips and the wiring conductor pattern disposed on said flexible substrate and said second terminals of said high frequency device and said wiring conductor pattern on said flexible substrate being electrically connected such that said at least one of said distributed constant circuit and lumped constant circuit performs impedance matching or transformation for said high frequency device.
6 more elements
A radio communication device comprising:
- a package comprising a first package portion having first terminals and a second package portion;
- a high frequency device having second terminals;
- and,
- a flexible substrate having wiring conductor patterns thereon including at least one of a distributed constant circuit and a lumped constant circuit;
- said first package portion having said high frequency device disposed therein;
- said flexible substrate with said at least one of said distributed constant circuit and lumped constant circuit being disposed above said high frequency device;
- said second package portion being disposed above said flexible substrate with said at least one of said distributed constant circuit and lumped constant circuit;
- and,
- said flexible substrate being of a bent shape such that said wiring conductor patterns contact said first terminals of said first package portion and said second terminals of said high frequency device and said wiring conductor patterns on said flexible substrate being electrically connected such that said at least one of said distributed constant circuit and said lumped constant circuit performs impedance matching or transformation for said high frequency device.
6 more elements
Dependencies are inferred from the claim text.