Double-sided oscillator package and method of coupling components thereto
AssigneeMotorola, Inc.
InventorsMark E. Kotzan, Thomas A. Knecht
Life of this patent
Estimating the term…
Abstract
A double-sided oscillator package and method of coupling components thereto. A package 100 having an open-top receptacle adapted to receive electronic components and an open-bottom receptacle 114 adapted to receive a piezoelectric element and a cover 116 for hermetically sealing the open-bottom receptacle 114. The electronic components and piezoelectric element are electrically connected. A hermetic environment 118 is established by coupling the cover 116 and open-bottom receptacle 114.
Claims12
A double-sided temperature compensated oscillator package, comprising:
- a platform including a central portion and an outer portion;
- sidewalls extending substantially upwardly and substantially downwardly from the outer portion of the platform, the upwardly extending sidewalls terminate at a surface mountable end portion, the surface mountable end portion includes a plurality of contacts for connection to an electrical device;
- the upwardly extending sidewalls and the platform forming an open-top receptacle adapted to receive electronic components and the downwardly extending sidewalls and the platform forming an open-bottom receptacle adapted to receive at least one piezoelectric component;
- a cover coupled with the open-bottom receptacle defining a hermetic environment;
- the open-top receptacle includes electronic components comprising at least one flip chip integrated circuit and a capacitor;
- and
- the open-bottom receptacle includes a piezoelectric component, whereby a surface mountable temperature compensated package is defined.
A double-sided temperature compensated oscillator package, comprising:
- a platform including a central portion and an outer portion;
- sidewalls extending substantially upwardly and substantially downwardly from the outer portion of the platform;
- the upwardly extending sidewalls and the platform forming an open-top receptacle and the downwardly extending sidewalls and the platform forming an open-bottom receptacle;
- a cover couplable with the open-bottom receptacle to provide a hermetic seal;
- the open-top receptacle including electronic components including at least one flip chip integrated circuit and a capacitor;
- and
- the open-bottom receptacle including a piezoelectric component, whereby a surface mountable temperature compensated package is defined.
A double-sided temperature compensated oscillator package, comprising:
- a platform including a central portion and an outer portion;
- sidewalls extending substantially upwardly and substantially downwardly from the outer portion of the platform;
- the upwardly extending Sidewalls and the platform forming an open-top receptacle and the downwardly extending sidewalls and the platform forming an open-bottom receptacle;
- a cover couplable with the open-bottom receptacle to provide a hermetic seal;
- the open-top receptacle including at least one electronic component including at least one integrated circuit;
- and
- the open-bottom receptacle including a piezoelectric component whereby a surface mountable temperature compensated package is defined, wherein the electronic component includes a flip chip integrated circuit and two chip capacitors.
Dependencies are inferred from the claim text.