Electrodeposited copper foil and process for making same

A process for making electrodeposited copper foil comprising:

• (A) flowing an electrolyte solution between an anode and a rotating cathode, applying an effective amount of voltage across said anode and said cathode to provide an effective current between said anode and said cathode having a current density in the range of about 0.1 to about 5 A/cm.sup.2, and depositing copper on said cathode;
• said electrolyte solution comprising copper ions, sulfate ions, chloride ions at a concentration of about 0.01 to about 1 ppm and at least one organic additive or derivative thereof;
• and
• (B) removing deposited copper from said cathode as a continuous thin web of copper foil;
• wherein said copper foil has an ultimate tensile strength measured at 23.degree. C. in the range of about 87,000 to about 120,000 psi, an elongation measured at 180.degree. C. of about 15% to about 28%, and a substantially uniform randomly oriented grain structure that is essentially columnar grain free and twin boundary free and has an average grain size of up to about 10 microns.

A process for making a copper foil comprising:

• (A) flowing an electrolyte solution between an anode and a rotating cathode, applying an effective amount of voltage across said anode and said cathode to provide an electric current between said anode and cathode having a current density in the range of about 1.2 to about 1.8 A/cm.sup.2, and depositing copper on said cathode;
• said electrolyte solution comprising copper ions, sulfate ions, chloride ions at a concentration of about 0.01 to about 0.5 ppm, and animal glue or a derivative thereof;
• (B) removing deposited copper from said cathode as a continuous thin web of copper foil;
• wherein said copper foil has an ultimate tensile strength measured at 23.degree. C. in the range of about 87,000 to about 120,000 psi, an elongation measured at 180.degree. C. of about 15% to about 28%, and a substantially uniform randomly oriented grain structure that is essentially columnar grain free and twin boundary free and has an average grain size of up to about 10 microns;
• and
• (C) adding animal glue to said electrolyte solution, the rate at which said animal glue is added being about 0.1 to about 30 mg/min/kA.