US 5,429,488 AGranted

Encapsulating molding equipment and method

AssigneeNeu Dynamics Corp.

InventorH. Karl Neu

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Abstract

Encapsulation molding equipment includes individual mold bases each having an elongated shallow recess which receives strip-like carriers supporting semi-conductor chips and like objects for encapsulation. Cavity inserts having various numbers of cavities of different size and dimension individual to carriers having like numbers of chips of a range of size and dimension fit over the strips with each cavity on an insert surrounding the chip to be encapsulated. Gate and vent passages are formed on the surface of the insert spaced away from the mold base member for supply of resin from a central resin receptacle. Gate passages in the cavity inserts are configured to provide a restriction at the edge of each mold cavity, thereby accelerating the flow of liquid resin, rapidly filling the cavities and avoiding the entrapment of gas bubbles. The inserts have mold vent passages which allow for rapid venting of displaced gases from the cavities. The mold is completed by an upper mold insert plate which closes the mold and effects a seal between the mold parts and provides for delivery of encapsulating resin to the cavities in the cavity inserts. Each mold base has a plurality of recesses, each of which receives a carrier strip and a cavity insert.

Claims18

Dependent claims

Equipment for encapsulation molding of objects on the upper surface of a rectangular carrier strip, wherein said carrier strip has a substantially flat lower surface, said molding equipment being adapted for use with a mold press having a base platen for support of the molding equipment and an upper platen, said base platen and said upper platen being relatively movable toward and away from one another, said molding equipment comprising:

(a) support means on said base platen including means defining an elongated, upwardly facing positioning recess having elongated side edges, a substantially horizontally disposed upwardly facing planar surface extended from an upper edge of said recess, encapsulating fluid delivery means, including at least one runner passage formed in the planar surface of said support means and extending to one of said elongated side edges;
(b) a carrier strip loading bar, said carrier strip loading bar interfitting within said recess, said carrier strip loading bar having side edges interfacing with the side edges of said recess, said carrier strip loading bar having an upwardly facing planar surface substantially free of surface irregularities for support of a carrier strip having objects to be encapsulated on its upper surface;
(c) a cavity insert for said carrier strip loading bar, said cavity insert having an upper planar surface, a plurality of spaced apart mold cavities extending through said cavity insert, said mold cavities corresponding in number to the objects on said carrier strip on said carrier strip loading bar and a lower surface surrounding each said mold cavity and adapted to interface with said carrier strip, each said cavity being dimensioned and positioned relatively to said objects to contain one of said objects and a charge of resin in an amount sufficient to encapsulate said object;
(d) cavity insert support means comprising fixed support surfaces for supporting of said cavity insert independently of said carrier strip loading bar;
(e) yieldable means for vertical adjustable support of said loading bar, the upper platen being in interengagement with the upper planar surface of said cavity insert and the upwardly facing planar surface of said support means when the upper platen and the base platen are relatively moved toward one other;
and
(f) gate passage means comprising gate grooves formed in the upper planar surface of said cavity insert, said gate grooves extending between each said cavity and said runner passage in the upwardly facing planar surface of said support means.

4 more elements

Equipment for encapsulation molding of objects projecting upwardly from the upper surface of a rectangular carrier strip, wherein said carrier strip has a substantially flat lower surface, said molding equipment being adapted for use with a mold press having a base platen for support of the molding equipment, an upper platen overlying said base platen, said base platen and said upper platen being relatively movable toward one another to a position in which the mold is closed and relatively away from one another to a position in which the mold is opened, said molding equipment comprising:

(a) mold support means comprising an elongated, upwardly facing positioning recess on said base platen, said recess having elongated side edges and a raised planar surface, said raised planar surface extending to one of said elongated side edges;
(b) encapsulating fluid delivery means including at least one runner passage formed in said raised planar surface, said runner passage extending to said one of said elongated side edges;
(c) a carrier strip loading bar interfitting within said recess, said carrier strip loading bar having a planar substantially uninterrupted upper surface for support of said carrier strip having objects to be encapsulated on its upper surface;
(d) a cavity insert for said carrier strip loading bar, said cavity insert having an upper planar surface, a plurality of spaced apart mold cavities extending through said cavity insert, said mold cavities corresponding in number to the objects on said carrier strip disposed on said carrier strip loading bar and having a lower surface surrounding each said mold cavity and adapted to interface with said carrier strip, each said cavity of said cavity insert being dimensioned and positioned relatively to said objects to surround one of said objects and to contain a charge of resin in an amount sufficient to encapsulate said object;
(e) said mold support means further comprising fixed support surfaces independent of said loading bar, said cavity insert having edge portions extending beyond the loading bar and interfacing with said fixed support surfaces when the cavity insert is in overlying relationship with said carrier strip independently of said loading bar with the upper planar surface of the cavity insert being substantially coplanar with the raised planar surface of said mold support means;
(f) means biasing the loading bar relatively upwardly, whereby the upper surface of said carrier strip is moved into sealing relationship with the lower surface of the cavity insert;
and
(g) gate passage means comprising gate grooves formed in the upper planar surface of said cavity insert, said gate grooves extending from each said cavity to a runner passage in said raised planar surface of said mold support means.

5 more elements

Equipment for encapsulation molding of objects projecting upwardly from the upper surface of a rectangular carrier strip, wherein said carrier strip has a substantially flat lower surface, said molding equipment being adapted for use with a mold press having a base platen for support of the molding equipment, an upper platen overlying said base platen, said base platen and said upper platen being relatively movable toward on another to a position in which the mold is closed and relatively away from one another to a position in which the mold is opened, said molding equipment comprising:

(a) positioning means on said base platen, said positioning means including a raised portion having a planar surface, said raised planar portion surface terminating in an elongated side edge portion;
(b) encapsulating fluid delivery means including at least one runner passage extending to said elongated side edge portion;
(c) a carrier strip loading bar positioned adjacent to said elongated side edge, said loading bar having a substantially uninterrupted planar upper surface for support of said carrier strip with the objects to be encapsulated disposed on its upper surface;
(d) a cavity insert for said carrier strip loading bar, said cavity insert having an upper planar surface, a plurality of spaced apart mold cavities extending through said cavity insert, said mold cavities corresponding in number to the objects on said carrier strip disposed on said carrier strip loading bar and having a lower surface surrounding each said mold cavity and interfacing with said carrier strip, each said cavity of said cavity insert being dimensioned and positioned relatively to said objects to surround one of said objects and to contain a charge of resin in an amount sufficient to encapsulate said object;
(e) said positioning means further comprising fixed support surfaces independent of said loading bar, said cavity insert having edge portions extending beyond the loading bar and interfacing with said fixed support surfaces when the cavity insert is in overlying relationship with said carrier strip for support of the insert independently of said loading bar with the upper planar surface of the cavity insert being substantially coplanar with the raised planar surface portion of said positioning means;
(f) means biasing the loading bar relatively upwardly, whereby the upper surface of said carrier strip is moved into sealing relationship with the lower surface of the cavity insert;
(g) gate passage means comprising gate grooves formed in the upper planar surface of said cavity insert, said gate grooves extending from each said cavity to a runner passage;
and
(h) the upper platen being in sealing relationship with the raised planar surface portion of said upper platen and the upper planar surface of said cavity insert when the mold is closed.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 08/275,651Filed 15 Jul 1994 · continuation
Priority: 24 Nov 1992
Granted: 4 Jul 1995
Term ends: Not estimatedThe source records don’t support an estimate.

Classification10 codes

H10W 74/016
Manufacture or treatment: using moulds
B29C 45/14655
For obtaining an insulating effect, e.g. for electrical components: connected to or mounted on a carrier, e.g. lead frame
B29C 45/2673
Moulds: with exchangeable mould parts, e.g. cassette moulds
B29C 45/2669
Moulds: with means for removing excess material, e.g. with overflow cavities

Family

Serial981,742Parent of this continuation-in-part · filed 24 Nov 1992
Serial52,545Parent of this continuation-in-part · filed 23 Apr 1993
Serial108,335Parent of this continuation · filed 18 Aug 1993
US 5,405,255 AParent of this continuation-in-part
US 5,316,463 AParent of this continuation-in-part
US 5,429,488 AThis patent

From the US filing history. Foreign family members aren’t listed.