Method of manufacturing semiconductor wafer and system therefor

A method of manufacturing a semiconductor wafer comprising the steps of:

• conveying a columnar ingot by an ingot conveying means and mounting it on a slicing machine;
• cutting said ingot mounted on said slicing machine into wafers by said slicing machine, each wafer including a slice base;
• conveying one of said wafers cut by said slicing machine by a first wafer conveying means to a peel-off means where the slice base of said wafer is peeled off said wafer by said peel-off means to create a peeled wafer;
• conveying the peeled wafer to a first wash-dry means by a second wafer conveying means where said peeled wafer is washed and dried by the first wash-dry means;
• conveying said peeled wafer which has been washed and dried by the first wash-dry means to a chamfering means by a third wafer conveying means where edges of said wafer are chamfered by said chamfering means to create a chamfered wafer;
• conveying said chamfered wafer to a second wash-dry means by a fourth wafer conveying means where said wafer is washed and dried by the second wash-dry means;
• and
• conveying said chamfered wafer which has been washed and dried by the second wash-dry means to a storing portion by a fifth wafer conveying means where the chamfered wafer is stored in the storing portion.