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US 5,426,130 AGranted
Adhesive system
AssigneeND Industries, Inc.
InventorsMark C. Thurber, Richard B. Wallace
Life of this patent
Estimating the term…
Abstract
An adhesive system capable of use to secure two substrates to one another. The adhesive system uses a resin and a hardener which are encased in a polymerized, integral film.
Claims25
An adhesive system, comprising:
- a fluid deposit consisting essentially of a hardener capable of polymerizing a resin, said hardener having throughout a UV-curable film-forming dimethacrylate and a photoinitiator compound capable, upon exposure to UV light, of curing said film-forming dimethacrylate to form an integral, thin, continuous, dry, substantially pin-hole free, flexible, non-tacky outer protective skin;
- and
- an integral, thin, continuous, dry, substantially pinhole free, flexible, non-tacky outer protective skin bounding at least one surface of said first fluid deposit formed by exposing a portion of said first fluid deposit to UV light.
An adhesive system comprising:
- a first fluid deposit;
- said first fluid deposit consisting essentially of an uncured epoxy resin having throughout a radiation-curable, film-forming material and a photoinitiator capable, upon exposure to UV radiation, of curing said film-forming material to form an integral, thin, continuous, dry, substantially pin-hole free, flexible, non-tacky outer protective skin;
- a first integral, thin, continuous, dry, non-tacky outer protective skin of selected thickness bounding at least one surface of said first fluid deposit formed by exposing a portion of said first fluid deposit to UV radiation;
- a second fluid deposit integral with said first fluid deposit;
- said second fluid deposit consisting essentially of a curing agent for said uncured epoxy resin having throughout a radiation-curable, film-forming dimethacrylate and a photoinitiator capable, upon exposure to UV radiation, of curing said film-forming dimethacrylate to form an integral, thin, continuous, dry, substantially pin-hole free, flexible, non-tacky outer protective skin;
- and
- a second integral, thin, continuous, dry, non-tacky outer protective skin of selected thickness bounding at least one surface of said second fluid deposit formed by exposing a portion of said second fluid deposit to UV radiation.
4 more elements
An adhesive package consisting essentially of:
- a first fluid mixture of uncured epoxy resin having throughout a radiation-curable, film-forming compound and a photoinitiator capable, upon exposure to radiation, of curing said film-forming material to form an integral, thin, continuous, dry, substantially pin-hole free, flexible, non-tacky outer protective skin;
- a first integral, continuous, dry, non-tacky outer protective skin of selected thickness bounding a surface of said first fluid mixture formed by exposing a portion of said first fluid mixture to radiation;
- a second fluid mixture of a curing agent for said uncured epoxy resin having throughout a radiation-curable, film-forming dimethacrylate and a photoinitiator capable, upon exposure to radiation, of curing said film-forming dimethacrylate to form an integral, thin, continuous, dry, substantially pin-hole free, flexible, non-tacky outer protective skin;
- and
- a second integral, continuous, dry, non-tacky outer protective skin of selected thickness bounding a surface of said second fluid mixture formed by exposing a portion of said second fluid mixture to radiation.
2 more elements
Dependencies are inferred from the claim text.