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US 5,426,074 AGranted
Process for fabricating an active matrix circuit
OwnerThomas P. Brodyinventor
Life of this patent
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Abstract
An improved method of fabricating integrated circuits, particularly active matrix arrays. The present method comprises applying an etch-resist pattern to an integrated circuit by printing to form resist patterns. The circuit is then etched, recoated with a different substance, a new ink pattern applied and the pattern repeated to form the successive layers of the integrated circuit.
Claims4
A method of manufacturing integrated circuits having at least one layer, comprising the steps of:
- coating a substrate with a conductive material forming a single layer of the circuit;
- applying an etch-resist pattern having line widths and spacings range from about 4.mu.-25.mu. to at least one layer of said coated substrate by printing said resist pattern onto said coated substrate;
- and
- placing said coated substrate with resist pattern in a bath to etch away desired portions of the coated substrate.
1 more element
Dependencies are inferred from the claim text.