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US 5,422,615 AGranted
High frequency circuit device
AssigneesHitachi, Ltd., Hitachi Video & Information System, Inc.
InventorsNobuhiko Shibagaki, Mitsutaka Hikita, Toyoji Tabuchi, Takatoshi Akagi, Satoshi Wakamori, Tomomi Matsumoto
Life of this patent
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Abstract
In a high frequency circuit device, inductive circuit elements constituting a matching circuit are constructed of so-called helical coils having fine metal wires wound in a hollow solenoid form, which are disposed inside a package in which a high frequency circuit element such as a surface acoustic wave element or the like is mounted. The high frequency circuit device may be utilized in equipment such as wireless communication equipment for reducing the size as well as providing good high frequency characteristics.
Claims33
A high frequency circuit device comprising:
- a package having an air-tight space inside thereof, said package including a substrate and a lid over a first surface of the substrate, said substrate having a hole in a second surface thereof;
- a high frequency circuit element secured on said first substrate surface in said air-tight space;
- and
- a helical signal coil disposed in said hole formed in said second substrate surface, wherein said helical signal coil is substantially oriented parallel to a plane containing said second substrate surface.
1 more element
A high frequency circuit device comprising:
- a first substrate;
- a frame implanted on a surface of said first substrate;
- a lid for forming an air-tight space with said frame and said first substrate;
- a second substrate formed adjacent to a rear surface of said first substrate, and having holes;
- a first conductor pattern and a second conductor pattern formed on the surface of said first substrate;
- a third conductor pattern and a fourth conductor pattern formed on the rear surface of said first substrate, at least portions of which are exposed in the holes of said second substrate;
- a fifth conductor pattern and a sixth conductor pattern formed on a rear surface of said second substrate;
- a first conductor for connecting said first conductor pattern with said third conductor pattern;
- a second conductor for connecting said second conductor pattern with said sixth conductor pattern;
- a third conductor for connecting said fourth conductor pattern with said fifth conductor pattern;
- a high frequency circuit element accommodated in said air-tight space and secured on said second conductor pattern, and having a surface electrode connected with said first conductor pattern through a wire;
- and
- a first helical coil accommodated in a first hole of said holes in said second substrate, and connected between said third conductor pattern and said fourth conductor pattern.
10 more elements
A high frequency circuit device comprising:
- a first substrate;
- a frame implanted on the surface of said first substrate;
- a lid for forming an air-tight space with said frame and said first substrate;
- a second substrate formed adjacent to the rear surface of said first substrate, and having holes;
- a first conductor pattern, a second conductor pattern, a third conductor pattern, a fourth conductor pattern, a fifth conductor pattern and a sixth conductor pattern formed on a surface of said first substrate;
- a seventh conductor pattern, an eighth conductor pattern, a ninth conductor pattern, a tenth conductor pattern, an eleventh conductor pattern and a twelfth conductor pattern formed on a rear surface of said first substrate;
- a first helical coil accommodated in a first hole of said holes of said second substrate, and connected between said seventh conductor pattern and said eighth conductor pattern, wherein at least some of the seventh, eighth, ninth, tenth, eleventh and twelfth conductor patterns are exposed in a second hole of said holes of said second substrate;
- a second helical coil accommodated in the second hole of said holes of said second substrate, and connected between said ninth conductor pattern and said tenth conductor pattern;
- a third helical coil accommodated in a third hole of said holes of said second substrate, and connected between said eleventh conductor pattern and said twelfth conductor pattern,
- a thirteenth conductor pattern, a fourteenth conductor pattern, a fifteenth conductor pattern and a sixteenth conductor pattern formed on a rear surface of said second substrate;
- a first conductor for connecting said first conductor pattern with said eighth conductor pattern;
- a second conductor for connecting said second conductor pattern with said fourteenth conductor pattern;
- a third conductor for connecting said third conductor pattern with said ninth conductor pattern;
- a fourth conductor for connecting said fourth conductor pattern with said tenth conductor pattern;
- a fifth conductor for connecting said fifth conductor pattern with said fifteenth conductor pattern;
- a sixth conductor for connecting said sixth conductor pattern with said eleventh conductor pattern;
- a seventh conductor for connecting said seventh conductor pattern with said thirteenth conductor pattern;
- an eighth conductor for connecting said twelfth conductor pattern with said sixteenth conductor pattern;
- a first high frequency circuit element accommodated in said air-tight space and secured on said second conductor pattern, and having two surface electrodes connected with said first conductor pattern and said third conductor pattern through wire respectively;
- and
- a second high frequency circuit element accommodated in said air-tight space and secured on said fifth conductor pattern, and having two surface electrodes connected with said fourth conductor pattern and said sixth conductor pattern through wire respectively;
- wherein said first conductor, said third conductor and said sixth conductor are each constructed by at least a via-hole conductor passing through said first substrate,
- said second conductor and said fifth conductor are each constructed by at least a via-hole conductor passing through said first substrate and said second substrate, and
- said seventh conductor and said eighth conductor are each constructed by at least a via-hole conductor passing through said second substrate.
21 more elements
A high frequency circuit device comprising:
- a package, including a lid covering a first surface of a substrate, said substrate having a hole in a second surface thereof, wherein said lid and said substrate enclose an air-tight space inside said package;
- a high frequency circuit element secured on said first substrate surface in said air-tight space;
- and
- a helical signal coil disposed in said hole formed in said second substrate surface;
- wherein said high frequency circuit element is a surface acoustic wave element.
2 more elements
A high frequency circuit device comprising:
- a package, including a lid covering a first surface of a substrate, said substrate having a hole in a second surface thereof, wherein said lid and said substrate enclose an air-tight space inside said package;
- a high frequency circuit element secured on said first substrate surface in said air-tight space;
- and
- a helical signal coil disposed in said hole formed in said second substrate surface;
- wherein said helical signal coil is an impedance matching device disposed in a high frequency signal line of said package, said high frequency signal line being electrically connected to said high frequency circuit element.
2 more elements
Wireless communication equipment of the type including a terminal having a motherboard mounting a high frequency circuit device, the improvement wherein the high frequency circuit device comprises:
- a package, including a lid covering a first surface of a substrate, said substrate having a hole in a second surface thereof, wherein said lid and said substrate enclose an air-tight space inside said package;
- a high frequency circuit element secured on said first substrate surface in said air-tight space;
- and
- a helical signal coil disposed in said hole formed in said second substrate surface;
- wherein said high frequency circuit element is a surface acoustic wave element.
2 more elements
Wireless communication equipment of the type including a terminal having a motherboard mounting a high frequency circuit device, the improvement wherein the high frequency circuit device comprises:
- a package, including a lid covering a first surface of a substrate, said substrate having a hole in a second surface thereof, wherein said lid and said substrate enclose an air-tight space inside said package;
- a high frequency circuit element secured on said first substrate surface in said air-tight space;
- and
- a helical signal coil disposed in said hole formed in said second substrate surface;
- wherein said helical signal coil is an impedance matching device disposed in a high frequency signal line of said package, said high frequency signal line being electrically connected to said high frequency circuit element.
2 more elements
A high frequency circuit device comprising:
- a package having an air-tight space inside thereof, said package including a substrate and a lid over a first surface of the substrate, said substrate having a hole in a second surface thereof;
- a high frequency circuit element secured on said first substrate surface in said air-tight space;
- a helical signal coil disposed in said hole formed in said second substrate surface;
- and
- a plurality of conductor patterns on said first substrate surface, wherein said conductor patterns constitute an electromagnetic shield between the helical signal coil and the high frequency circuit element.
2 more elements
Dependencies are inferred from the claim text.