Precision high rate electroplating cell and method
OwnerGeorge Tzanavaras, Uri Coheninventors
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Abstract
A precision high rate electroplating cell comprising a rotating anode/jet assembly (RAJA) immersed in the electrolyte and having high pressure electrolyte jets aimed at the substrate (cathode). The high pressure jets facilitate efficient turbulent agitation at the substrate's surface, even when it consists of complex shapes or mask patterns. High aspect ratio areas receive similar degree of agitation (and replenishment) as areas of lower aspect ratios. As a result, thickness and composition micro-uniformities are substantially improved while utilizing significantly higher current densities and plating rates.
Claims28
An apparatus for electroplating a metal film on the surface of a substrate, said apparatus comprising:
- a plating chamber adapted to contain an electroplating solution;
- a cathode holder assembly for holding said substrate;
- an anode/jet assembly adapted to face said substrate and having a plurality of nozzles arranged so as to direct jets of said electroplating solution toward the surface of said substrate at a direction essentially normal thereto;
- a drive for causing relative rotation between said anode/jet:
- assembly and said cathode holder assembly;
- and
- a power supply for generating an electroplating current through said electroplating solution between said anode/jet assembly and said substrate,
- wherein said nozzles are configured so as to provide a substantially uniform flow distribution of said electroplating solution over the surface of said substrate as said relative rotation occurs between said anode/jet assembly and said cathode holder assembly.
A method of electroplating a metal film on the surface of a substrate using an anode/jet assembly having an anode portion and a plurality of nozzles, said method comprising:
- positioning said substrate near said nozzles such that a flow of an electroplating solution through said nozzles is directed substantially normal to said surface;
- causing relative rotation to occur between said anode/jet assembly and said substrate;
- supplying an electroplating solution to said anode/jet assembly such that a substantially uniform flow distribution of said electroplating solution strikes the surface of said substrate as said relative rotation occurs between said anode/jet assembly and said substrate, and
- generating an electroplating current through said electroplating solution between said anode/jet assembly and said substrate.
Dependencies are inferred from the claim text.