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US 5,421,926 AGranted
Transparent conductive substrate and method of making the same
AssigneesSumitomo Metal Mining Co., Ltd., Tohoku Chemical Industries, Ltd.
InventorsMasaya Yukinobu, Munekazu Kawata, Yasuo Tsukui
Life of this patent
Estimating the term…
Abstract
A transparent conductive substrate comprising a base plate member allowing transmission therethrough of visible light, a transparent, overcoat layer formed on the base plate member, and a transparent conductive film which is formed on the overcoat layer, containing ultra-fine particles of indium-tin oxide having a particle size of 0.1 .mu.m or smaller, having light transmittance of 70% or higher and exhibiting surface resistance of 200 .OMEGA./.quadrature. lower. This transparent conductive substrate has low surface resistance and excellent optical characteristics.
Claims22
A method of making a transparent conductive substrate comprising:
- a step to print or apply patterns of a transparent conductive ink onto a base board, dry and calcine said ink for forming a transparent conductive film,
- a step to apply a transparent overcoat liquid to said transparent conductive film for forming a transparent overcoat layer on said transparent conductive film,
- a step to bond said base board to a base plate member with said overcoat liquid in a condition where said overcoat layer is opposed to said base plate member, and then set said overcoat layer, and
- a step to peel off said base board from said base plate member for offsetting said overcoat layer and transparent conductive film onto said base plate member.
1 more element
A method of making a transparent conductive substrate comprising:
- a step to print or apply patterns of a transparent conductive ink onto a base board, dry and calcine said ink for forming a transparent conductive film,
- a step to apply a transparent overcoat liquid to said transparent conductive film for forming a transparent overcoat layer on said transparent conductive film,
- a step to bond said base board to a base plate member with a transparent bonding agent in a condition where said overcoat layer is opposed to said base plate member, and then set said overcoat layer and said bonding agent, and
- a step to peel off said base board from said base plate member for offsetting said overcoat layer and transparent conductive film onto said base plate member.
1 more element
A method of making a transparent conductive substrate comprising:
- a step to print or apply patterns of a transparent conductive ink onto a base board for forming a transparent conductive film,
- a step to apply a transparent overcoat liquid onto said transparent conductive film for forming a transparent overcoat layer on said transparent conductive film,
- a step to bond said base board to a base plate member with said overcoat liquid, and then set said overcoat layer, and a step to remove at least a portion of said base board by dissolution or swelling to allow said transparent conductive film to remain on said base plate member.
A method of making a transparent conductive substrate comprising:
- a step to print or apply patterns of a transparent conductive ink onto a base board for forming a transparent conductive film,
- a step to apply a transparent overcoat liquid onto said transparent conductive film for forming a transparent overcoat layer on said transparent conductive film,
- a step to bond said base board to a base plate member with a transparent bonding agent, and then set said overcoat layer and said bonding agent, and
- a step to remove at least a portion of said base board by dissolution or swelling to allow said transparent conductive film to remain on said base plate member.
1 more element
A method of making a transparent conductive substrate comprising:
- a step to form, on a base board, a coating layer containing ultra-fine particles formed of a conductive oxide and having thickness of 0.5 .mu.m or thinner,
- a step to print or apply patterns of a transparent conductive ink onto said coating layer, dry said ink, roll said ink with a steel roller and calcine said ink for forming a transparent conductive film on said coating layer,
- a step to apply a transparent overcoat liquid onto said transparent conductive film for forming a transparent overcoat layer on said transparent conductive film,
- a step to bond said base board to a light transmitting base plate member by using said overcoat liquid in a condition where said overcoat layer is opposed to said base plate member, and then set said overcoat layer, and
- a step to peel off said base board from said base plate member for offsetting said overcoat layer and said transparent conductive film onto said base plate member.
2 more elements
A method of making a transparent conductive substrate comprising:
- a step to form, on a base board, a coating layer containing ultra-fine particles formed of a conductive oxide and having thickness of 0.5 .mu.m or thinner,
- a step to print or apply patterns of a transparent conductive ink onto said coating layer, dry said ink, roll said ink with a steel roller and calcine said ink for forming a transparent conductive film on said coating layer,
- a step to apply a transparent overcoat liquid onto said transparent conductive film for forming a transparent overcoat layer on said transparent conductive film,
- a step to bond said base board to a light transmitting base plate member by using a transparent bonding agent in a condition where said overcoat layer is opposed to said base plate member, and then set said overcoat layer and said bonding agent, and
- a step to peel off said base board from said base plate member for offsetting said overcoat layer and said transparent conductive film onto said base plate member.
2 more elements
A method of making a transparent conductive substrate comprising:
- a step to form a coating layer on a base board,
- a step to print or apply patterns of a transparent conductive ink, dry and calcine said ink for forming a transparent conductive film on said coating layer,
- a step to apply a transparent overcoat liquid onto said transparent conductive film for forming a transparent overcoat layer on said transparent conductive film,
- a step to bond said base board to a light transmitting base plate member by using said overcoat liquid in a condition where said overcoat layer is opposed to said base plate member, and then set said overcoat layer, and
- a step to peel off said base board from said base plate member for offsetting said overcoat layer and said transparent conductive film onto said base plate member.
2 more elements
A method of making a transparent conductive substrate comprising:
- a step to form a coating layer on a base board,
- a step to print or apply patterns of a transparent conductive ink, dry and calcine said ink for forming a transparent conductive film on said coating layer,
- a step to apply a transparent overcoat liquid onto said transparent conductive film for forming a transparent overcoat layer on said transparent conductive film,
- a step to bond said base board to a light transmitting base plate member by using a transparent bonding agent in a condition where said overcoat layer is opposed to said base plate member, and then set said overcoat layer and said bonding agent, and
- a step to peel off said base board from said base plate member for offsetting said overcoat layer and said transparent conductive film onto said base plate member.
2 more elements
Dependencies are inferred from the claim text.