Glassy binder system for ceramic substrates, thick films and the like

Abstract

A ceramic material for electronic circuit devices is sintered at less than r equal to 1000.degree. C. temperature. A filler material such as quartz and a glassy binder RO--Al.sub.2 O.sub.3 --B.sub.2 O.sub.3 are mixed together along with an appropriate glassy binder prior to firing. RO is drawn from the group of metal oxides MgO, CaO, SrO, BaO, ZnO or CdO and the glassy binders form no more than 40 vol % of the ceramic material. The glassy binder has a suitable viscosity and other properties so that after it is mixed with the quartz filler, sintering occurs at the relatively low temperature. As a consequence, high conductivity conductors made of copper, silver and gold can be appropriately metallized prior to firing. The strength and low dielectric constant of the ceramic material make the material well adapted for ceramic substrates, thick films and the like which are used in VHSIC and VLSI applications.

Dependencies are inferred from the claim text.