Back to results
US 5,407,488 AGranted
Method and apparatus for in-situ removal of material from openings in a stencil
AssigneeAT&T Corp.
InventorRajarshi Ray
Life of this patent
Estimating the term…
Abstract
In-situ removal of material, such as solder paste (12), from openings (26--26) in a stencil (22) is accomplished by imparting a vibrational motion to the stencil. In practice, the stencil (22) may be vibrated by one or more DC solenoids (28--28), each having its plunger (28) in contact with the periphery of the stencil and each excited with AC so that the solenoid plunger undergoes a linear oscillation to vibrate the stencil.
Claims5
A method for effecting in-situ removal of material from openings in a stencil following the printing of material through the stencil openings onto a surface, comprising the steps of:
- displacing the surface away from the stencil once a volume of the material has been printed onto the surface;
- and
- vibrating the stencil to cause material remaining in the stencil openings to separate therefrom to maintain the stencil openings substantially free from material to improve the quality of a subsequent printing operation.
Dependencies are inferred from the claim text.