Method of compliantly mounting a piezoelectric device
AssigneeMotorola, Inc.
InventorsCharles Zimnicki, Iyad Alhayek
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Abstract
A method of compliantly mounting piezoelectric device with a substrate. First, outer portions of a piezoelectric element are selectively metallized. Next, one layer of aluminum is selectively dispensed on the piezoelectric element. Third, an uncured conductive compliant material is placed and aligned on a substrate. Fourth, the piezoelectric element is placed and aligned on the conductive compliant material, such that upon curing the conductive compliant material forms a compliant mount connecting the outer metallized portions of the piezoelectric element with the substrate.
Claims14
A method of compliantly mounting a piezoelectric device with a substrate, comprising the steps of:
- (a) selectively metallizing outer portions of a piezoelectric element with a material which is substantially resistant to oxidation;
- (b) selectively depositing at least one layer of a light weight metal on the piezoelectric element, by:
- (i) forming a predetermined electrode pattern;
- and (ii) overlapping the outer metallized portions with the light weight metal such that at least part of the oxidation resistant material is exposed;
- (c) selectively dispensing an uncured conductive compliant material on a substrate;
- and
- (d) placing and aligning the piezoelectric element on the conductive compliant material, such that upon curing the conductive compliant material forms a compliant mount connecting the exposed oxidation resistant material with the substrate.
A method of compliantly mounting a piezoelectric device with a substrate, comprising the steps of:
- (a) selectively metallizing outer portions of a piezoelectric element, by;
- providing a first layer comprising chromium directly on the outer portions of the piezoelectric element;
- providing a second layer comprising a precious metal on the first layer;
- and
- providing a third layer comprising chromium on the precious metal layer;
- (b) selectively depositing at least one layer of aluminum on the piezoelectric element, by:
- (i) forming a predetermined electrode pattern;
- and (ii) contacting the outer metallized portions;
- (c) selectively dispensing an uncured conductive compliant material on a substrate;
- and
- (d) placing and aligning the piezoelectric element on the conductive compliant material, such that upon curing the conductive compliant material forms a compliant mount connecting the outer metallized portions of the piezoelectric element with the substrate.
A method of compliantly mounting an overtone piezoelectric device with a substrate, comprising the steps of:
- (a) selectively metallizing outer portions of a piezoelectric element, by;
- providing a first layer comprising chromium directly on an outer portion of the piezoelectric element;
- providing a second layer comprising a precious metal on the first layer;
- and
- providing a third layer comprising chromium on the precious metal layer;
- (b) selectively depositing a layer of aluminum by:
- (i) forming a predetermined electrode pattern;
- and (ii) forming an overlap portion connected to the metallized outer portions;
- (c) dispensing a conductive compliant adhesive on the substrate;
- (d) placing the piezoelectric element on the conductive compliant material;
- and
- (e) curing the conductive compliant material such that a compliant connection is formed coupling the outer metallized portions of the piezoelectric element with the substrate.
Dependencies are inferred from the claim text.