Resurf lateral double diffused insulated gate field effect transistor
AssigneeTexas Instruments Incorporated
InventorsOh-Kyong Kwon, Taylor R. Efland, Satwinder Malhi, Wai T. Ng
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AssigneeTexas Instruments Incorporated
InventorsOh-Kyong Kwon, Taylor R. Efland, Satwinder Malhi, Wai T. Ng
Estimating the term…
A transistor (10) has a thin epitaxial layer (14) of a second conductivity type on a semiconductor substrate (12) of a first conductivity type. A drift region (24) of the second conductivity type is formed extending through the thin epitaxial layer (14) to the substrate (12). A thick insulator layer (26) is formed on the drift region (24). An IGFET body (28) of the first conductivity type is formed adjacent the drift region (24). A source region (34) of the second conductivity type is formed within the IGFET body (28) and spaced from the drift region (24) defining a channel region (40) within the IGFET body (28). A conductive gate (32) is insulatively disposed over the IGFET body (28) and extends from the source region (34) to the thick insulator layer (26). A drain region (36) is formed adjacent the drift region (24).
A transistor formed on a semiconductor layer of a first conductivity type comprising:
A reduced surface field lateral double diffused insulated gate field effect transistor formed on a semiconductor layer of a first conductivity type comprising:
Dependencies are inferred from the claim text.