Optical device
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsTeruhiro Shiono, Hisahito Ogawa
Life of this patent
Estimating the term…
Abstract
An optical device of this invention includes; a semiconductor laser chip having an emitting end face for emitting laser light; a transparent substrate, allowing the laser light to transmit therethrough, having a first surface, and having a second surface facing the first surface; and a silicon substrate, located above the transparent substrate, having an oblique surface inclined with respect to the second surface, and having a parallel surface parallel to the second surface; wherein the semiconductor laser chip is located on the oblique surface of the silicon substrate; and the laser light emitted from the semiconductor laser chip propagates through the transparent substrate in a zigzag manner between the first surface and the second surface.
Claims20
An optical device comprising:
- a semiconductor laser chip having an emitting end face for emitting laser light;
- a transparent substrate, allowing said laser light to transmit therethrough, having a first surface, and having a second surface facing said first surface;
- and
- a substrate, located abutting said transparent substrate, having an oblique surface inclined with respect to said second surface, and having a parallel surface parallel to said second surface;
- wherein said semiconductor laser chip is located on said oblique surface of said substrate;
- and
- said laser light emitted from said semiconductor laser chip propagates through said transparent substrate in a zigzag manner between said first surface and said second surface.
An optical device comprising:
- a semiconductor laser chip having an emitting end face for emitting laser light;
- a transparent substrate, allowing said laser light to transmit therethrough, having a first surface, a second surface facing said first surface, and a third surface substantially perpendicular to said second surface;
- and
- a silicon substrate, located on said transparent substrate, having an oblique surface inclined with respect to said third surface, and having a parallel surface parallel to said third surface;
- wherein said oblique surface of said silicon substrate is formed by anisotropic etching;
- said semiconductor laser chip is located on said oblique surface of said silicon substrate;
- and
- said laser light emitted from said semiconductor laser chip propagates through said transparent substrate in a zigzag manner between said first surface and said second surface.
An optical device comprising:
- a semiconductor laser chip having an emitting end face for emitting laser light;
- a transparent substrate, allowing said laser light to transmit therethrough, having a first surface and a second surface facing said first surface;
- a silicon substrate, located on said transparent substrate, having an oblique surface inclined with respect to said second surface, and having a parallel surface parallel to said second surface;
- and
- a light detector formed on said parallel surface of said silicon substrate, for detecting said laser light propagated through said transparent substrate, and for generating an electric signal corresponding to said detected laser light,
- wherein said oblique surface of said silicon substrate is formed by anisotropic etching;
- said semiconductor laser chip is located on said oblique surface of said silicon substrate;
- and
- said laser light emitted from said semiconductor laser chip propagates through said transparent substrate in a zigzag manner between said first surface and said second surface.
An optical device comprising:
- a semiconductor laser chip having an emitting end face for emitting laser light;
- a transparent substrate, allowing said laser light to transmit therethrough, having a first surface, and having a second surface facing said first surface;
- a light detector for detecting said laser light and generating an electric signal corresponding to said detected laser light;
- a silicon substrate, located on said transparent substrate, having an oblique surface inclined with respect to said second surface, and having a parallel surface parallel to said second surface;
- and
- a first optical element, formed on said first surface of said transparent substrate, for collimating and reflecting said laser light;
- a second optical element, formed on said first surface of said transparent substrate, for converging said laser light collimated by said first optical element on an object which exists outside said transparent substrate;
- a third optical element, formed on said first surface of said transparent substrate, for converging said laser light reflected by said object on said light detector;
- and
- a reflective layer, formed on said second surface of said transparent substrate, for reflecting said laser light,
- wherein said semiconductor laser chip is located on said oblique surface of said silicon substrate;
- and
- said light detector is formed on said parallel surface of said silicon substrate.
Dependencies are inferred from the claim text.