Semiconductor integrated circuit device

A semiconductor integrated circuit device comprising:

• a semiconductor pellet having a main surface and a rear surface opposite said main surface, a plurality of electrode pads formed on said main surface;
• an insulating multi-layered substrate comprising a first conductive layer, a second conductive layer, a plurality of signal conductive strips, and first and second insulating layers, said second insulating layer being stacked on said first insulating layer, said signal conductive strips being formed between said first and second insulating layers, said first insulating layer being stacked over said first conductive layer, and said second conductive layer being stacked on said second insulating layer, wherein said insulating multi-layered substrate is formed around said semiconductor pellet;
• a plurality of first and second conductive strips formed over said first conductive layer and on said first insulating layer, wherein said first conductive strips are electrically connected to said first conductive layer, wherein said second conductive layer is for supplying a first reference potential to said semiconductor pellet and said first conductive layer is for supplying a second reference potential to said semiconductor pellet;
• first bonding wires, second bonding wires and third bonding wires, each of said first bonding wires being electrically connected to one of said electrode pads and one of said first conductive strips, each of said second wires being electrically connected to one of said electrode pads and to one of said second conductive strips, and each of said third bonding wires being electrically connected to one of said electrode pads and to said signal conductive strips;
• a plurality fourth bonding wires, each electrically connected to said second conductive layer and one of said second conductive strips;
• a plurality of external extension leads electrically connected to said signal conductive strips;
• and
• a resin molding body in which said semiconductor pellet, said multi-layered substrate, said wires and a part of each of said external extension leads are molded.