Semiconductor device with enhanced adhesion between heat spreader and leads and plastic mold compound
AssigneeTexas Instruments Incorporated
InventorBobby O'Donley
Life of this patent
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Abstract
A semiconductor device (10) includes a semiconductor die (18) and a heat spreader (16) adjacent the semiconductor die (18) for carrying heat away from the semiconductor die (18). The heat spreader (16) has a copper core (30) and a cupric oxide coating (32) formed on at least a portion of the core (30). A plastic package (12) is molded onto the semiconductor die (18) and the heat spreader (16) for supporting the semiconductor die (18) and the heat spreader (16). The cupric oxide coating (32) enhances adhesion of the heat spreader (16) to the plastic package (12).
Claims18
A semiconductor device, comprising:
- a semiconductor die;
- a heat spreader adjacent said semiconductor die for carrying heat away from said semiconductor die, said heat spreader having a copper core and a cupric oxide coating formed on at least a portion of said core;
- and
- a plastic package molded onto said semiconductor die and said heat spreader for supporting said semiconductor die and said heat spreader, said cupric oxide coating for enhancing adhesion of said heat spreader to said plastic package.
A semiconductor device, comprising:
- a semiconductor die;
- at least one lead electrically connected to said semiconductor die, said at least one lead having a copper core and a cupric oxide coating formed on a portion of said core;
- and
- a plastic package molded onto said semiconductor die and said at least one lead for supporting said semiconductor die and said at least one lead, said at least one lead extending from said plastic package, said cupric oxide coating for enhancing adhesion of said at least one lead to said plastic package.
Dependencies are inferred from the claim text.