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US 5,401,910 AGranted
Electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsHarufumi Mandai, Noboru Kato, Koji Shiroki
Life of this patent
Estimating the term…
Abstract
A ceramic substrate has a single plating film formed on both wiring electrodes formed on an upper surface of a ceramic body and external electrodes formed on side surfaces and a lower surface of the ceramic body. The plating film on the wiring electrodes and the external electrodes has a first plating layer made of Ni and a second plating layer made of Sn.
Claims15
An electronic component comprising:
- a ceramic body having a pair of major surfaces and side surfaces connecting said pair of major surfaces to each other;
- at least one wiring electrode formed on one of the major surfaces of said ceramic body;
- at least one external electrode formed on at least one of the side surfaces and the other major surface of said ceramic body for electrical connection to an interior electrode contained inside the ceramic body or for electrical connection to said at least one wiring electrode;
- and
- a plating film formed on both said at least one wiring electrode and said at least one external electrode.
2 more elements
Dependencies are inferred from the claim text.