Printed circuit board with locally enhanced wiring density

A printed circuit board comprising:

• a dielectric material having at least one inner electrically conductive layer;
• electrically conducting lines located on an external surface of said dielectric material in a first region of a first width and having a first wiring density;
• a layer of a second dielectric material substantially covering a localized sub-region of said first region of said electrically conducting lines and including a plurality of holes therein, selected ones of said holes being located relative to respective ones of said conducting lines in said sub-region, said localized sub-region having a second width less than said first width of said first region, said layer of second dielectric material not including an internal layer of conductive wiring therein;
• and
• a plurality of electrical conductors located only on said layer of second dielectric material and electrically coupled to said respective ones of said conducting lines in said localized sub-region through said holes, said electrical conductors being of a second wiring density substantially greater than said first wiring density of said electrically conducting lines.