Method of manufacturing a light-emitting semiconductor device substrate
AssigneeShin-Etsu Handatai Co. Ltd.
InventorsMasato Yamada, Takao Takenaka, Shinji Orimo
Life of this patent
Estimating the term…
Loading patent…
AssigneeShin-Etsu Handatai Co. Ltd.
InventorsMasato Yamada, Takao Takenaka, Shinji Orimo
Estimating the term…
Disclosed are a light-emitting semiconductor device substrate and a method of manufacturing the same. The substrate is prepared by causing a Ga.sub.1-x Al.sub.x As compound semiconductor single crystalline thick-film layer having a first AlAs mole fraction and a low Al containing and oxidation-delaying Ga.sub.1-y Al.sub.y As compound semiconductor single crystalline thin film serving as a surface protective layer and having a second AlAs mole fraction to be sequentially grown on a GaAs crystal substrate. The method comprises the step of causing the thick-film layer and the thin film to be sequentially grown on the GaAs crystal substrate. The GaAs crystal substrate is removed after sequential epitaxial growth of the thick-film layer and thin film on the GaAs crystal substrate.
A method of manufacturing a light-emitting semiconductor device substrate used in forming of a GaAlAs double hetero junction structure, comprising:
Dependencies are inferred from the claim text.