Method for fabrication solid state radiation imager having improved scintillator adhesion
AssigneeGeneral Electric Company
InventorsRobert F. Kwasnick, Roger S. Ehle, Richard J. Saia
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AssigneeGeneral Electric Company
InventorsRobert F. Kwasnick, Roger S. Ehle, Richard J. Saia
Estimating the term…
A method of fabricating a radiation imager with strong structural integrity and adhesion between the scintillator and photosensor array includes the steps of forming a photosensor array on a substrate; depositing a barrier layer over the photosensor array, the barrier layer having an upper surface of silicon nitride; treating the silicon nitride upper surface of the barrier layer to prepare the surface for the deposition of material thereover; and depositing a scintillator material over the treated upper surface of the barrier layer. The silicon nitride upper surface of the barrier layer is typically treated by etching the surface, such as in a reactive ion etch, for a selected amount of time, with less than about 500 .ANG. of material being removed from the surface.
A method of fabricating a mechanically robust amorphous silicon imager having strong adhesion between the scintillator and an underlying moisture barrier layer, comprising the steps of:
Dependencies are inferred from the claim text.