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US 5,401,616 AGranted
Patterning method employing laser
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsAkira Isomi, Masato Hagino
Life of this patent
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Abstract
A patterning method includes the steps of irradiating an excimer laser beam to a material layer so as to form a pattern on the material layer; and transferring onto a substrate, the material layer formed with the pattern; and irradiating the excimer laser beam to the material layer transferred onto the substrate so as to form a further pattern on the material layer.
Claims6
A patterning method comprising the steps of:
- irradiating an excimer laser beam to a material layer formed on a peel layer provided on a support member so as to form a pattern on the material layer;
- the material layer being formed by a plurality of layers which are made of different materials, respectively, and are piled on one another;
- transferring onto a substrate through an adhesive layer, the material layer formed with the pattern;
- and
- irradiating the excimer laser beam to the material layer transferred onto the substrate so as to form a further pattern on the material layer.
2 more elements
A patterning method comprising the steps of:
- irradiating an excimer laser beam to a material layer so as to form a pattern on the material layer;
- transferring onto a substrate, the material layer formed with the pattern;
- and
- irradiating the excimer laser beam to the material layer so as to form a further pattern on the material layer;
- the material layer being formed by a plurality of layers which are made of different materials, respectively, and are piled on one another.
2 more elements
Dependencies are inferred from the claim text.