Method of providing moisture-free enclosure for electronic device

A method of packaging an electronic device in an electronic package, comprising:

• providing on a surface in said package a coating or adhesive with desiccant properties, wherein said coating or adhesive includes a powder dispersed in a polymer containing the elements carbon and hydrogen and one or more of oxygen, nitrogen, sulfur, a halogen element, and silicon in its repeating unit, said powder is a protonated alumino silicate
• --of the formula H.AlO.sub.2 .multidot.(SiO.sub.2).sub.x, where x=1-20,
• --having a void fraction of 10-50 volume percent,
• --having an average pore diameter of 2.5-15 Angstroms,
• --having an average particle size of 0.2-100 micrometers,
• --with said powder to said polymer weight ratio being 0.001-2;
• and sealing the package containing the electronic device to prevent moisture from entering therein.

A method for packaging an electronic device comprising the steps of:

• A. applying to said device or to part of an interior surface of a package for containing said device a mixture including a polymer and a protonated alumino silicate powder
• --of the formula H.AlO.sub.2 .multidot.(SiO.sub.2).sub.x, where x=1-20,
• --having a void fraction of 10-50 volume percent,
• --having an average pore diameter of 2.5-15 Angstroms,
• --and having an average particle size of 0.2-100 micrometers;
• said polymer containing the elements carbon, hydrogen and one or more of oxygen, nitrogen, sulfur, a halogen element, and silicon in its repeating unit, with said powder to said polymer weight ratio being 0.001-2;
• and
• B. sealing the package containing the electronic device to prevent moisture from entering therein.