Method for packaging hot melt adhesives

A method for packaging hot melt adhesive compositions comprising the steps of:

• a. lining a rigid mold with a single layer of a thermoplastic film selected from the group consisting of ethylene/vinyl acetate, ethylene acrylate, ethylene methacrylate, ethylene methyl acrylate, ethylene methyl methacrylate, high density polyethylene, low density polyethylene, copolymers of ethylene and C. 1-6 mono- or diunsaturated monomers, blends thereof, polyamides, polybutadiene rubber, polyesters, polycarbonates, atactic poly-alpha-olefins, thermoplastic polyacrylamides, polyacrylonitrile and copolymers thereof, polymethyl pentene, polyphenylene sulfide, aromatic polyurethanes, sytrene-acrylonitrile, acrylonitrile-butadiene-styrene, styrene-butadiene rubbers, polyethylene terephthalate, polyphenylene sulfide and polyvinyl aromatic-rubber block copolymers, said film being meltable together with the adhesive composition and blendable into said molten adhesive composition upon subsequent use, and said mold being in contact with a refrigerant gas or liquid heat sink;
• b. pouring molten hot melt adhesive into the lined mold at a temperature above the melting point of the thermoplastic film thereby creating some degree of fusion between the adhesive and the plastic film while the refrigerant gas or liquid heat sink serves to prevent the plastic film from melting or deteriorating;
• and
• c. allowing the molten hot melt adhesive to solidify so as to form a packaged hot melt adhesive.