Method for forming tough, electrical insulating layer on surface of copper material
AssigneeUsui Kokusai Sangyo Kabushiki Kaisha
InventorKunio Katsuma
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Abstract
A method is provided for forming a tough, electrical insulating layer on a surface of a copper material. The copper material is made of copper of a copper-based alloy at least in the surface thereof. According to the method, the copper material is anodized first in an alkaline electrolyte bath of a caustic alkali to form a thin film layer of cupric oxide on the surface of the copper material, and next in an acidic electrolytic bath of a hexacyanoiron complex.
Claims6
A method for forming a tough, electrical insulating layer on a surface of a copper article, said copper article having a surface which is made of copper or a copper-based alloy, said method comprising:
- (i) anodizing the surface of the copper article in an alkaline electrolyte bath of a caustic alkali to form a thin film layer of cupric oxide on the surface of the copper article;
- and
- (ii) anodizing the surface of the copper article which has been anodized in step (i), in an acidic electrolytic bath of a hexacyanoiron complex.
Dependencies are inferred from the claim text.