Method of printing a bonding agent
AssigneeKabushiki Kaisha Toyoda Jidoshokki Seisakusho
InventorKazuhiro Maeno
Life of this patent
Estimating the term…
Abstract
Lands formed on the top surface of substrate are covered by a printing screen having a printing pattern, in order to mount chip components on the substrate. A paste bonding agent is supplied to the lands through the printing pattern, and a layer of bonding agent is formed on the lands. In the printing method, a plurality of bonding agent layers that are mutually separated are formed on the land. The chip component is placed on the bonding agent layers of the land. As the chip component is pressed to the land, the bonding agent layers are smashed and spread on the land prior to applying heat to said bonding agent layers.
Claims7
A method of mounting chip components on a substrate having electrically conductive lands formed on a top surface thereof which method comprises the steps of covering said lands with a printing screen having a printing pattern,
- forming a plurality of mutually separated bonding agent layers on said lands by applying said bonding agent to the lands through the printing pattern such that less than the full surface area of each of said lands is covered by said bonding agent layers;
- placing at least one of said chip components on said bonding agent layers;
- and
- pressing said chip components that have been placed on said bonding agent layers toward said land to spread said bonding agent layers on said lands prior to applying heat to said bonding agent layers.
A method of mounting chip components on a substrate having electrically conductive lands formed on a top surface thereof which method comprises the steps of covering said lands with a printing screen having a printing pattern;
- forming a plurality of mutually separated solder layers on said lands by employing said printing screen with a printing pattern which has a plurality of openings similar to the desired solder layers, and applying paste solder to said lands through said openings;
- placing said chip components on said solder layers;
- and
- pressing said chip components toward said lands to spread said solder layers on said lands prior to melting said solder layers.
Dependencies are inferred from the claim text.