Method for soldering hard substances onto steels
AssigneeDegussa AG
InventorsWolfgang Weise, Harald Krappitz, Willi Malikowski
Life of this patent
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Abstract
When hard-substance parts are soldered onto steel bases, thermal stresses are produced between the hard substance and the steel. These stresses can be reduced by means of using a multilayer solder in which the middle layer consists of a precipitation-hardenable copper alloy or nickel alloy provided on both sides with a layer of a hard-solder alloy whose working temperature is at least 50.degree. C. below the melting point of the precipitation-hardenable copper alloy or nickel alloy. A tempering treatment at 250.degree. to 550.degree. C. is carried out after the soldering in order to achieve a precipitation hardening of the middle layer.
Claims9
A method for soldering a hard cutting material onto a base substrate of steel to make a work cutting tool comprising selecting a three-layer solder composite in which the middle layer consists of a copper alloy or nickel alloy, said middle layer being provided on each side thereof with a layer of a hard solder whose working temperature is located at least 50.degree. C. below the melting point of the copper alloy or nickel alloy of the middle layer, said copper alloy and nickel alloy being a precipitation-hardenable copper layer or nickel layer, soldering said composite onto said steel and said hard cutting material at a soldering temperature, preventing melting of the middle layer during the soldering by selecting the working temperature and the alloy so as to avoid melting, and thereafter tempering by heating at 250.degree.to 550.degree. C. following the soldering for a precipitation hardening of the middle layer.
A three-layer solder composite comprising a middle layer of a copper alloy or nickel alloy, said middle layer having two opposite surfaces and being provided on each surface thereof with a layer of a hard solder having a melting point of the copper alloy or nickel alloy wherein said hard solder is selected from the group consisting of:
- Ag with 25 to 34% by weight Cu,, 18 to 25% by weight Zn, 1 to 5% by weight Mn and 0.3 to 1% by weight Ni with a working temperature of 650.degree. to 700.degree. C.;
- Ag with 20 to 35% by weight Cu, 4 to 8% by weight In, 1 to 3% by weight Ni and 1 to 3% by weight Mn with working temperatures of 710.degree. to 800.degree. C.;
- Cu with 15 to 20% by weight Ag, 20 to 30% by weight n, 15 to 20% by weight Cd, 2 to 3% by weight Mn and 0.3 to 0.7% by weight Ni with working temperatures of 570.degree. to 780.degree. C.;
- and Cu with 10 to 15% by weight Mn and 1 to 4% by weight Ni with working temperatures between 850.degree. and 1000.degree. C., said copper alloy and said nickel alloy being precipitation hardenable, said hard solder having a working temperature of at least 50.degree. C. below the melting point of said copper or nickel alloy.
Dependencies are inferred from the claim text.