Method of preparing compound semiconductor
AssigneeMitsubishi Chemical Corporation
InventorsHideki Goto, Kenji Shimoyama
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AssigneeMitsubishi Chemical Corporation
InventorsHideki Goto, Kenji Shimoyama
Estimating the term…
A method of preparing a compound semiconductor is carried out, by introducing the group III organic metals gas and/or the hydrides containing group V elements, or group V organic metals gas into a growth chamber, in addition to a carrier gas and an etching gas, in a method of preparing a group III-V compound semiconductor including the process to effect the gas etching of a single crystal sustrate surface and/or a single crystal thin-film surface in the growth chamber, just before a vapor phase growth of a compound semiconductor thin-film is performed, using the hydrides and the organic metals gas. According to the present invention, the impurity pollution, the oxide film, the thermometamorphism and the hike, in an interface between the single crystal substrate and the epitaxial layer as well as in the regrown interface can be removed, thereby making it possible to get a clean surface of the interface and to restrain the accumulation or the depletion of carrier-concentration which has not been intended. As a result, the quality of the device can be greatly improved as compared with that of the one obtained by a usual preparing method.
In a method of preparing a III-V group compound semiconductor including a process of effecting gas etching of a single crystal substrate surface and/or a single crystal thin-film surface in a crystal growth chamber, just before vapor phase growth of a compound semiconductor thin-film is carried out using hydrides and an organic metals gas, the improvement comprises introducing the hydrides containing III-group organic metals gas and/or V-group elements, or V-group organic metals gas into the crystal growth chamber, in addition to a carrier gas and a etching gas.
Dependencies are inferred from the claim text.