Universal interconnect matrix array

A universal interconnect matrix array comprising:

• a substrate having a plurality of input/output pads situated along a primary surface of said substrate, data being transmissible to and from the interconnect matrix array only through said input/output pads during normal array operation, said input/output pads being arranged in an area matrix of rows and columns such that at least one of said input/output pads is internal to the input/output pads along the periphery of said area matrix and is connectable to external electronic components;
• a first set of conductive leads formed across the primary surface in a first direction;
• a second set of conductive leads formed across the primary surface in a second direction not parallel to said first direction, at least one conductive lead in each of said sets of conductive leads being divided into at least two separate conductive segments, selected ones of said conductive leads or segments in both of said sets of conductive leads being connected to at least half of said input/output pads;
• and
• means for electrically interconnecting selected ones of said conductive leads or segments in said first set of conductive leads to selected ones of said conductive leads or segments in said second set of conductive leads, wherein:
• said first set of conductive leads comprises a first plurality of groups of rows of conductive leads, each of at least two of said groups of rows of conductive leads being located between two adjacent rows of said input/output pads;
• and
• said second set of conductive leads comprises a second plurality of groups of columns of conductive leads, each of at least two of said groups of columns of conductive leads being located between two adjacent columns of said input/output pads.

A crosspoint switch formed as an integrated circuit dedicated for programmably interconnecting electronic components external to the integrated circuit, the crosspoint switch comprising:

• a substrate having a primary surface;
• a plurality of input/output pads situated along the primary surface for connection to said external electronic components, said input/output pads being arranged in an area matrix of rows and columns such that at least one of said input/output pads is internal to the input/output pads along the periphery of said area matrix and is connectable to external electronic components;
• a first set of conductive leads formed across the primary surface in a first direction;
• a second set of conductive leads formed across the primary surface in a second direction substantially different from the first direction, at least one conductive lead in at least one of said sets of conductive leads being divided into at least two separate conductive segments, selected ones of said conductive leads or segments in both sets of conductive leads being connected to said input/output pads;
• and
• means for programmably interconnecting selected ones of said conductive leads or segments in said first set of conductive leads to selected ones of said conductive leads or segments in said second set of conductive leads, wherein:
• said first set of conductive leads comprises a first plurality of groups of rows of conductive leads, each of at least two of said groups of rows of conductive leads being located between two adjacent rows of said input/output pads;
• and
• said second set of conductive leads comprises a second plurality of groups of columns of conductive leads, each of at least one of said groups of columns of conductive leads being located between two adjacent columns of said input/output pads.