A method of testing the electrical conductivity of a first connection between an integrated circuit device and a circuit board to which the device is connected, a second connection also connecting said device to said board, said device including therewithin a current path between said first and second connections, said method comprising the steps of, while the circuit is inoperative:
- applying via said board a first voltage to said second connection;
- applying via said board a second different voltage to said first connection;
- and, having applied said first and second voltages, utilizing probe means positioned adjacent said device to sense indirectly current in said current path within the device, the presence of current indicating that said first connection is conductive.