Low temperature flexible die attach adhesive and articles using same
AssigneeJohnson Matthey PLC
InventorsMy N. Nguyen, Yuan Y. Chien
Life of this patent
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Abstract
Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.
Claims16
A semiconductor device adhered with a flexible adhesive to a substrate from the group of flexible organic polymeric substrates and lead frames, said adhesive comprising a cyanate ester vehicle rendered flexible by reaction with one of hydroxyl, amine, and epoxide reactive functional groups having a Tg of less than about 25.degree. C., or mixtures thereof, and silver in an amount sufficient to function as a curing catalyst and to enable said adhesive to be cured in not greater than 5 minutes at 200.degree. C.
A card for processing in a computer, said card having a semiconductor device enveloped therein and adhered with an adhesive to a substrate from the group of flexible organic polymeric substrates and leadframes, said adhesive comprising a flexible resin with a glass transition temperature of less than about 25.degree. C., a cyanate ester vehicle containing at least one of hydroxyl, amine, and epoxide reactive functional groups, an alkylphenol, a metal containing curing catalyst and a thermally and/or electrically conductive filler.
A semiconductor device adhered with an adhesive to a substrate from the group of flexible organic polymeric substrates and lead frames, said adhesive comprising a cyanate ester vehicle rendered flexible by reaction with at least one polyhydroxyl polymer compounds within at least one of the following formula:
- HO--(CH.sub.2).sub.m --CO--O--(CH.sub.2).sub.n --OH
- and
- HO--(CH.sub.2).sub.m --O--C--O--R--C--O--(CH.sub.2).sub.n --OH
- and silver in an amount sufficient to function as a curing catalyst and to enable said adhesive to be cured in not greater than 5 minutes at 200.degree. C.
A card for processing in a computer, said card having a semiconductor device enveloped therein and adhered with an adhesive to a substrate from the group of flexible organic polymeric substrates and leadframes, said adhesive comprising a flexible resin with a glass transition temperature of less than about 25.degree. C., a cyanate ester vehicle containing at least one polyhydroxyl polymer compound within at least one of the following formula:
- HO--(CH.sub.2).sub.m --CO--O--(CH.sub.2).sub.n --OH
- and
- HO--(CH.sub.2).sub.m --O--C--O--R--C--O--(CH.sub.2).sub.n --OH,
- an alkylphenol, a metal containing curing catalyst and a thermally and/or electrically conductive filler.
Dependencies are inferred from the claim text.