Resin sealed semiconductor device including multiple current detecting resistors
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsZiro Honda, Takashi Takahashi
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Abstract
A resin sealed semiconductor device has a plurality of current-detecting resistors mounted and electrically connected in parallel on leads of a lead frame for detecting the current flowing in a semiconductor element mounted on the lead frame. Mounting n current-detecting resistors in parallel reduces the increase in resistance due to mounting to 1/nth the conventional value. Accordingly, changes in resistance values during mounting are minimized for accurate current measurement.
Claims5
A resin sealed semiconductor device including a lead frame having a die pad and leads, a semiconductor element mounted on the die pad, a controlling semiconductor element for controlling the semiconductor element, and a current-detecting resistance mounted on leads of the lead frame for detecting current flowing in the semiconductor element and comprising a plurality of current-detecting resistors mounted and electrically connected in parallel.
Dependencies are inferred from the claim text.