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US 5,399,904 AGranted
Array type semiconductor device having insulating circuit board
AssigneeKabushiki Kaisha Toshiba
InventorHiroyuki Kozono
Life of this patent
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Abstract
There is provided a semiconductor device comprising a lead frame including an island and a plurality of leads, a semiconductor chip, mounted on the island, having bonding pads, the semiconductor chip further including circuit blocks connected to bonding pads, and an insulating circuit substrate, mounted on the island, including a plurality of conductive layers each having connection pads. In the structure, the bonding pads are connected to the connection pads to provide electrical connections among the circuit blocks.
Claims10
A semiconductor device comprising:
- a lead frame including an island and a plurality of leads;
- a semiconductor chip mounted on said island and having bonding pads, said semiconductor chip further including circuit blocks connected to said bonding pads;
- an insulating circuit board with four sides including a plurality of conductive layers each having connection pads, said insulating circuit board having an opening and being mounted on said island so as to surround said semiconductor chip through said opening;
- said plurality of conductive layers being arranged in rows along each of said four sides so as to be electrically separated from one another;
- a first group of bonding wires for connecting some of said bonding pads to some of said connection pads;
- a second group of bonding wires for connecting some of said connection pads to some of said plurality of leads;
- and
- said bonding pads being connected to said connection pads to substantially provide electrical connections among said circuit blocks.
5 more elements
A semiconductor device comprising:
- a lead frame having an island and a plurality of leads;
- a semiconductor chip mounted on said island and having first and second bonding pads, said semiconductor chip further including first and second circuit blocks respectively connected electrically to said first and second bonding pads;
- an insulating circuit board having a top surface and an opening and being mounted on said island so that the opening surrounds said semiconductor chip;
- said insulating circuit board including a conductive pattern contained completely on said top surface, said conductive pattern having first, second, and third connection pads electrically connected to each other;
- first and second bonding wires respectively connecting said first bonding pad to said first connection pad and said second bonding pad to said second connection pad so as to provide an electrical connection between said first and second circuit blocks;
- and
- a third bonding wire connecting said third connection pad to one of said plurality of leads so as to electrically connect said semiconductor chip to said lead frame.
4 more elements
Dependencies are inferred from the claim text.