Foreign particle inspection apparatus

A method for inspecting a surface of an object, comprising:

• irradiating ultraviolet light pulses for generating fluorescence onto a predetermined region of the object;
• detecting integration of the fluorescence from said predetermined region irradiated by said irradiating ultraviolet light pulses;
• and
• inspecting a surface condition of the object on the basis of a result of said detecting.

An exposure apparatus, comprising:

• an inspection system for inspecting a surface of a substrate having a pattern;
• and
• an exposure system for performing pattern transfer, said exposure system including an optical system for irradiating exposure light onto the substrate;
• said inspection system comprising:
• illumination means for irradiating ultraviolet light pulses for generating fluorescence onto a predetermined region of the substrate;
• detection means, including an accumulating type photoelectric transducer, for detecting accumulation of the fluorescence from said predetermined region in response to a plurality of the irradiating ultraviolet light pulses;
• and
• inspecting means for inspecting a surface condition of the substrate on the basis of a result of detection by said detection means.

A semiconductor device manufacturing method, comprising:

• preparing a reticle having a circuit pattern and a wafer;
• inspecting a surface of the reticle;
• and
• printing the circuit pattern onto the wafer by irradiating exposure light onto the reticle;
• wherein said inspecting step comprises the steps of:
• irradiating ultraviolet light pulses for generating fluorescence onto a predetermined region of the reticle;
• detecting accumulation of the fluorescence from said predetermined region by an accumulating type photoelectric transducer in response to a plurality of said irradiating ultraviolet light pulses;
• and
• inspecting a surface condition of the reticle on the basis of a result of said detecting.

A semiconductor device manufactured by a method comprising the steps of:

• preparing a reticle having a circuit pattern and a wafer;
• inspecting a surface of the reticle;
• and
• printing the circuit pattern on the wafer by irradiating exposure light onto the reticle;
• wherein said inspecting step comprises the steps of:
• irradiating ultraviolet light pulses for generating fluorescence onto a predetermined region of the reticle;
• detecting accumulation of the fluorescence from said predetermined region by an accumulating type photoelectric transducer in response to a plurality of said irradiating ultraviolet light pulses;
• and
• inspecting a surface condition of the reticle on the basis of a result of said detecting.