Multi-layer lead frame for a semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorToshikazu Takenouchi
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Abstract
A multi-layer lead frame for a semiconductor device includes a signal layer made of a metal strip having a signal pattern including a plurality of lead lines. A power supply or ground layer is adhered and laminated to the signal layer by means of an adhesive film. The adhesive film is an electrically insulation connector tape having through holes extending in a thickness direction. Conductive metal vias are filled in the through holes for electrically connecting the power supply or ground layer particular leads among the plurality of lead lines.
Claims10
A multi-layer lead frame for a semiconductor device comprising:
- a signal layer having a signal pattern including a plurality of lead lines each formed of a metal strip;
- at least one metal layer adhered and laminated to said signal layer by means of a self-adhesive connector film;
- said connector film being an electrically insulating polymer tape having through holes extending in a thickness direction thereof;
- and
- conductive metal vias formed in said through holes for electrically connecting said metal layer to one or more particular leads among said plurality of lead lines.
A multi-layer lead frame for a semiconductor device comprising:
- a signal layer having first and second surfaces having a signal pattern including a plurality of lead lines each formed of a metal strip;
- a first metal layer adhered and laminated to said first surface of said signal layer by means of a first connector film;
- a second metal layer adhered and laminated to said second surface of said signal layer by means of a second connector film;
- said first and second connector films being electrically insulating polymer tapes each having through holes extending in a thickness direction thereof, wherein at least one of said first and second connector films is self-adhesive;
- and
- conductive metal vias formed in said through holes for electrically connecting said first and second metal layers to one or more particular leads, respectively, among said plurality of lead lines.
Dependencies are inferred from the claim text.