Polyamino oligomers and polymaleimide compounds
AssigneeSumitomo Chemical Company, Limited
InventorsShigeki Naitoh, Yasuhiro Endo, Youichi Ueda, Kunimasa Kamio
Life of this patent
Estimating the term…
Loading patent…
AssigneeSumitomo Chemical Company, Limited
InventorsShigeki Naitoh, Yasuhiro Endo, Youichi Ueda, Kunimasa Kamio
Estimating the term…
The polyamino oligomers of this invention are obtained by reacting diisopropenylbenzenes or bis(.alpha.-hydroxyisopropyl)benzenes and anilines in the presence of an acid catalyst and characterized by the recurring unit having an indane skeleton. These polyamino oligomers can be used as curing agent for laminate resins. Also, they can be reacted with maleic anhydride to prepare polymaleimide compounds of this invention. The polymaleimide compounds of this invention are low in melting point (or softening point) and, in combination with a substance producing three-dimensional crosslinkage such as triallyl isocyanurate, aromatic diamine, etc., can provide thermosetting resin compositions suited for producing copper-clad laminates. The copper-clad laminates obtained from the thermosetting resin compositions of this invention are low in dielectric constant, heat-resistant and also low in water absorptivity, so that they are useful for multi-layer printed boards.
Polymaleimide compounds represented by the formula (5):
Dependencies are inferred from the claim text.