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US 5,399,441 AGranted
Method of applying opaque coatings
AssigneeDow Corning Corporation
InventorsClayton R. Bearinger, Robert C. Camilletti, Loren A. Haluska, Keith W. Michael
Life of this patent
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Abstract
Disclosed is a method of forming opaque coatings on integrated circuits. The method comprises selectively applying a coating of a silica precursor resin and a filler onto the integrated circuit and heating the coated circuit at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.
Claims16
A method of forming a radiopaque coating on an integrated circuit comprising:
- applying a coating composition comprising a silica precursor resin and a filler comprising an insoluble salt of a heavy metal onto the surface of an integrated circuit, wherein the coating composition is selectively applied such that the bond pads to be used for interconnection and the streets are not coated;
- and
- heating the coated integrated circuit to a temperature sufficient to convert the coating composition into a ceramic coating.
A method of forming an optically opaque coating on an integrated circuit comprising:
- applying a coating composition comprising a silica precursor resin and an optically opaque filler onto an integrated circuit, wherein the coating composition is selectively applied such that the bond pads to be used for interconnection and the streets are not coated;
- and
- heating the coated electronic substrate at a temperature sufficient to convert the coating composition into a ceramic coating.
Dependencies are inferred from the claim text.