Method of fabricating conductive structures on substrates
AssigneeCeridian Corporation
InventorsDeepak K. Pai, Lowell D. Lund
Life of this patent
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Abstract
The present invention is an integrated heat sink module and a method of fabricating conductive structures on a substrate. The method of the present invention includes cleaning a substrate material to remove any impurities present on the substrate surface. The method further includes placing a protective layer resilient to chemicals used in conductive structure formation, on a first surface. The first surface is opposite a second surface on which conductive structures are formed. The method includes forming conductive structures on the second surface of the substrate. The protective layer is then removed from the first surface of the substrate.
Claims26
A method for fabricating thin-film conductive structures on composite substrates, the method comprising:
- providing a composite substrate having first and second surfaces, the first surface being different from the second surface;
- depositing a polyimide layer, resistant to chemicals used in thin-film conductive structure formation, on the first surface of the substrate;
- forming thin-film conductive structures on the second surface of the substrate;
- and
- removing the polyimide layer from the first surface of the substrate.
A method for fabricating thin-film conductive structures on composite substrates, the method comprising:
- providing a composite substrate having first and second surfaces, the first surface being different from the second surface;
- placing a titanium layer on the first surface;
- placing a copper layer on the titanium layer;
- placing a nickel layer on the copper layer, the titanium layer, copper layer and nickel layer forming a protective layer resistant to chemicals used in thin-film conductive structure formation on the first surface of the substrate;
- forming thin-film conductive structures on the second surface of the substrate;
- and
- removing the protective layer from the first surface of the substrate.
Dependencies are inferred from the claim text.