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US 5,399,202 AGranted
Resist-peeling liquid and process for peeling a resist using the same
AssigneeHitachi, Ltd.
InventorsHiroshi Kikuchi, Yasushi Sano, Satoru Todoroki, Hitoshi Oka, Toshiyuki Koshita, Masato Kikuchi, Mitsuo Nakatani, Michio Tsukii
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Abstract
A resist is peeled without leaving a residue after peeling, by bringing a resist-peeling liquid comprising a primary aliphatic amine of 2-6 carbon atoms into contact with the surface of an etched novolak positive photoresist, and removing the resist-peeling liquid containing the thus peeled resist from the surface of the etched resist. The used resist-peeling liquid can easily be recovered and regenerated.
Claims8
A process for peeling a resist which comprises the steps of:
- (a) changing the quality of a novolak positive resist layer on a substrate by an oxidative wet etching solution of metallic chromium, dry etching of silicon or aluminum, dry etching using oxygen plasma, or ion implantation,
- (b) contacting the changed resist of step (a) with a liquid comprising 80% by weight or more of 2-amino-1-ethanol, and
- (c) removing the liquid containing the thus peeled resist from the surface of the etched resist.
Dependencies are inferred from the claim text.