Preparation of surfaces for solder joining
AssigneeElectrovert Ltd.
InventorMichael T. Mittag
Life of this patent
Estimating the term…
Abstract
An apparatus and process prepares surfaces on components, boards and the like for assembly and solder joining. Oxides and other coatings can be removed from surfaces to be soldered without having to solder coat surfaces prior to joining. A polymer and an activator combination is applied to the surfaces, the polymer being thermally de-polymerizable and the combination removing oxides from the surfaces. The surfaces are heated after application of the polymer and activator to de-polymerize the polymer. Solder is then applied to solder join the surfaces.
Claims34
A method of solder joining surfaces of elements comprising the steps of:
- applying a polymer and activator combination to the surfaces of the elements to be solder joined, the polymer being thermally de-polymerizable, the activator being oxalic acid, and the combination removing oxides from the surfaces;
- heating the elements after the application of the polymer and activator combination to de-polymerize the polymer;
- and
- applying solder to solder join the surfaces.
A method of solder joining surfaces of elements comprising the steps of:
- applying a polymer and activator combination to the surfaces of the elements to be solder joined, the polymer being a polycarbonate type polymer and de-polymerizing in a temperature range of about 150.degree. to 170.degree. C., the activator being an oxalic acid, and the combination removing oxides from the surfaces;
- heating the elements after the application of the polymer and activator combination to de-polymerize the polymer;
- and
- applying solder to solder join the surfaces.
A method of solder joining surface of elements comprising the steps of:
- applying a polymer and activator combination in one of a powder and vapor form to the surfaces of the elements to be solder joined, the polymer being thermally de-polymerizable and the combination removing oxides from the surfaces;
- heating the elements after the application of the polymer and activator combination to de-polymerize the polymer;
- and
- applying solder to solder join the surfaces.
Dependencies are inferred from the claim text.