US 5,398,863 AGranted

Shaped lead structure and method

AssigneeTessera, Inc.

InventorsGary W. Grube, Gaetan Mathieu, Jason Sweis, John A. Grange

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Abstract

In a semiconductor inner lead bonding process, a connection component having leads is disposed on the chip surface so that the leads lie above the contacts. A bond region of each lead is forced downwardly by a tool into engagement with a contact on the chip while a first or proximal end of the lead remains attached to a dielectric support structure. The lead is deformed into an S-shaped configuration by moving the bonding tool horizontally towards the proximal or first end of the lead, thereby forcing the bonding region towards the first end and bending or buckling the lead. Alternatively, the lead is bent downwardly by a tool and the tool may then be disengaged from the lead, shifted away from the proximal end of the lead and again advanced downwardly to secure the lead to the chip contact.

Claims13

Dependent claims

A method of making connections to a part of a semiconductor chip assembly comprising the steps of:

(a) juxtaposing a connection component with the part so that a support structure in said connection component overlies a front surface of a part of said assembly having contacts thereon and so that elongated connection sections of leads on said connection component extend from said support structure above said contacts;
(b) bonding said connection section of each said lead to a contact on said part by engaging a tool with a bond region of the connection section and displacing the tool and bond region downwardly towards said part so as to bring the bond region of the connection section into engagement with the contact while leaving a first end of the connection section attached to said support structure;
and
(c) during said bonding step for each said lead, moving said tool and the bond region of the connection section relative to said support structure and relative to the first end of said connection section with a component of motion in a horizontal direction towards said first end of the connection section.

1 more element

A method of making connections to a part of a semiconductor chip assembly comprising the steps of:

(a) juxtaposing a connection component with the part so that a support structure in said connection component overlies a front surface of a part of said assembly having contacts thereon and so that elongated connection sections of leads on said connection component extend from said support structure above said contacts;
and
(b) bonding said connection section of each said lead to a contact on said part by
(i) deforming the connection section by engaging a tool with a deforming region of the connection section and displacing said tool and the deforming region downwardly towards said part so as to move the deforming region of the connection section downwardly towards the part while leaving a first end of the connection section attached to said support structure;
then
(ii) securing a bond region of the connection section to the contact, the bond region being further from the first end than the deforming region.

3 more elements

Dependencies are inferred from the claim text.