Superinsulation panel with thermoelectric device and method

A thermoelectric assembly mounted on a superinsulation panel for controlling the temperature within an enclosed structure comprising:

• the superinsulation panel formed in part by an envelope having a first wall and a second wall;
• a thermoelectric device with a first heat sink disposed on one side of the thermoelectric device and the other side of the thermoelectric device contacting the exterior of the first wall of the envelope;
• a second heat sink contacting the exterior of the second wall;
• and
• a cold finger disposed within the envelope between the first wall and the second wall for use in transferring heat energy from the second heat sink to the thermoelectric device.

The method of coupling a thermoelectric assembly with a superinsulation panel comprising the steps of:

• forming the superinsulation panel from a gas-tight envelope having a first wall and a second wall;
• placing a cold finger within the envelope between the first wall and the second wall;
• mounting a thermoelectric device on the exterior of the first wall adjacent to the cold finger with a first heat sink attached to the thermoelectric device opposite from the cold finger;
• and
• mounting a second heat sink on the second wall adjacent to the cold finger.